Multi-layer circuit substrates and electrical assemblies having conductive composition connectors

An electrical assembly comprising:

• a first conducting region;
• a second conducting region;
• a dielectric layer disposed between the first and second conducting regions and having an aperture;
• and
• a via structure including a conductive composition in a cured state disposed within the aperture and electrically communicating with the first and second conducting regions, said conductive composition comprising:
• conductive particles in an amount of at least about 75 wt. % based on the weight of the composition, wherein at least 50% by weight of the conductive particles have melting points of less than about 400.degree. C.;
• and
• a carrier including an epoxy-functional resin in an amount of at least about 50 wt. % based on the weight of the carrier, the epoxy functional resin having a viscosity of less than about 1000 centipoise at 25.degree. C., and a fluxing agent in an amount of at least about 0.1 wt % based on the weight of the carrier.

A multi-layer circuit substrate comprising:

• a first circuitized structure having a conducting region;
• a second circuitized structure having a conducting region;
• a dielectric layer disposed between the first and second circuitized layers and having an aperture;
• and
• a via structure including a conductive composition in a cured state disposed within the aperture and electrically communicating with the conducting regions of the first and second circuitized structures, said conductive composition being made by the process comprising:
• mixing conductive particles and a carrier together to form a mixture, wherein the conductive particles are in an amount of at least about 75 wt. % based on the weight of the composition, wherein at least 50% by weight of the conductive particles have melting points less than about 400.degree. C.;
• and wherein the carrier includes an epoxy-functional resin in an amount of at least about 50 wt. % based on the weight of the carrier, the epoxy functional resin having a viscosity of less than about 1000 centipoise at 25.degree. C., and a fluxing agent in an amount of at least about 0.1 wt % based on the weight of the carrier.

An electrical assembly comprising:

• a first conducting region;
• a second conducting region;
• a dielectric layer disposed between the first and second conducting regions and having an aperture;
• and
• a via structure including a conductive composition in a cured state disposed within the aperture and electrically communicating with the first and second conducting regions, said conductive composition being made by the process comprising:
• mixing conductive particles and a carrier together to form a mixture, wherein the conductive particles are in an amount of at least about 75 wt. % based on the weight of the composition, wherein at least 50% by weight of the conductive particles have melting points less than about 400.degree. C.;
• and wherein the carrier includes an epoxy-functional resin in an amount of at least about 50 wt. % based on the weight of the carrier, the epoxy functional resin having a viscosity of less than about 1000 centipoise at 25.degree. C., and a fluxing agent in an amount of at least about 0.1 wt % based on the weight of the carrier.