H10W 72/2524
Eutectic alloys
Official title: {Eutectic alloys}
H10W72/2524 (Eutectic alloys) appears on 56 US grants and 70 published applications in this corpus.
Search patents in H10W- Granted patents
- 56
- Published applications
- 70
- Assignees
- 38
- Inventors
- 169
- Latest grant
- 10 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 1 | 0 |
| 2004 | 1 | 1 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 2 |
| 2011 | 0 | 2 |
| 2012 | 1 | 1 |
| 2013 | 1 | 5 |
| 2014 | 5 | 4 |
| 2015 | 2 | 4 |
| 2016 | 3 | 6 |
| 2017 | 5 | 3 |
| 2018 | 2 | 5 |
| 2019 | 5 | 1 |
| 2020 | 4 | 11 |
| 2021 | 6 | 4 |
| 2022 | 2 | 4 |
| 2023 | 6 | 8 |
| 2024 | 4 | 0 |
| 2025 | 4 | 3 |
| 2026 | 2 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bonding structure10 Mar 2026US 12,573,810 B2Teknologian tutkimuskeskus VTT Oy
- Display panel and display device17 Feb 2026US 12,557,697 B2Shanghai Tianma Microelectronics Co., Ltd.
- Flip-chip light emitting diode having connecting electrodes with multiple binding layers including eutectic system with tin7 Oct 2025US 12,439,753 B2Xiamen San'an Optoelectronics Co., Ltd.
- Chip packaging structure and related inner lead bonding method17 Jun 2025US 12,334,470 B2Sitronix Technology Corp.
- Display device and method for manufacturing the same27 May 2025US 12,315,855 B2Japan Display Inc.
- Interconnect with low-temperature solder cap6 Aug 2026US 2026/0231807 A1Intel Corporation
- Semiconductor device and methods of formation11 Jun 2026US 2026/0165196 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Display panel and display device4 Jun 2026US 2026/0157237 A1Shanghai Tianma Microelectronics Co., Ltd.
- Die attach structures for light-emitting diode chips on lead frames5 Mar 2026US 2026/0068373 A1CreeLED, Inc.
- Flip-chip light emitting diode having connecting electrodes with multiple binding layers including eutectic system with tin15 Jan 2026US 2026/0020399 A1Xiamen San'an Optoelectronics Co., Ltd.
Most cited
By later US patents
- Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof61US 5,611,481 AFujitsu Limited · 1997
- Package on package structure and method of manufacturing the same12US 8,901,726 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Integrated electronic device having flip-chip connection with circuit board4US 5,977,637 AFujitsu Limited · 1999
- Metal pillar in a film-type semiconductor package3US 10,354,967 B2Samsung Electronics Co., Ltd. · 2019
- Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof3US 6,608,381 B1Fujitsu Limited · 2003