Metal pillar in a film-type semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsJung-woo Kim, Woon-bae Kim, Bo-in Noh, Go-woon Seong, Ji-yong Park
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Abstract
A film-type semiconductor package includes a metal lead portion arranged on a film substrate, a semiconductor chip including a pad, and a bump connecting the metal lead portion to the pad of the semiconductor chip. The bump includes a metal pillar arranged on the pad and including a first metal and a soldering portion arranged on an entire surface of the metal pillar, bonded to the metal lead portion, and including the first metal and a second metal that is different from the first metal.
Claims17
A film-type semiconductor package comprising:
- a metal lead portion on a film substrate;
- a semiconductor chip including a pad;
- and
- a bump connecting the metal lead portion to the pad of the semiconductor chip, the bump including,
- a metal pillar on the pad and including a first metal;
- and
- a soldering portion on an entire surface of the metal pillar, bonded to the metal lead portion, and including the first metal and a second metal that is different from the first metal the soldering portion having a top surface that is substantially flat;
- and
- wherein the metal lead portion comprises a metal lead and a lead protective layer protecting a surface of the metal lead, and a lower surface of the metal lead portion is below and within the top surface of the soldering portion;
- the metal lead includes a copper layer, and
- the lead protective layer includes a tin layer.
A film-type semiconductor package comprising:
- a metal lead portion extending from an outer lead bonding portion at one side portion of a film substrate to an inner lead bonding portion;
- a semiconductor chip including a pad;
- and
- a bump connecting the metal lead portion of the inner lead bonding portion to the pad of the semiconductor chip, the bump including,
- a metal pillar on the pad and including a first metal;
- and
- a soldering portion on an entire surface of the metal pillar, bonded to the metal lead portion, and including the first metal and a second metal that is different from the first metal the soldering portion having a top surface that is substantially flat;
- wherein
- the metal lead portion includes a metal lead and a lead protective layer protecting a surface of the metal lead, and a lower surface of the metal lead portion is below and within the top surface of the soldering portion;
- the metal lead includes a copper layer, and
- the lead protective layer includes a tin layer.
A bonding bump bonded to a lead portion in a semiconductor package, the bonding bump comprising:
- a metal pillar including a first metal;
- and
- a soldering portion including a first soldering layer on the metal pillar, the soldering portion being bonded to the lead portion and including a eutectic alloy layer of the first metal including a second metal, the soldering portion having a top surface that is substantially flat;
- wherein
- the lead portion includes a metal lead and a lead protective layer protecting a surface of the metal lead, and a lower surface of the metal lead is below and within the top surface of the soldering portion,
- the metal lead includes a copper layer, and
- the lead protective layer includes a tin layer.
Dependencies are inferred from the claim text.