Package on package structure and method of manufacturing the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChun-Cheng Lin, Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu
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Abstract
A package on package structure includes a first substrate having a first region and a second region, a bump formed on the first region of the first substrate, a first semiconductor die bonded to the second region of the first substrate, and a semiconductor die package bonded to the first substrate. The bump includes a metallic structure and a plurality of minor elements dispersed in the metallic structure. The semiconductor die package includes a connector bonded to the bump, and the first semiconductor die is between the semiconductor die package and the first substrate.
Claims20
A package on package structure, comprising:
- a first substrate having a first region and a second region;
- a bump formed on the first region of the first substrate, wherein the bump comprises a metallic structure and a plurality of minor elements dispersed in the metallic structure, wherein the metallic structure comprises a central core formed of a metal material and a solder material layer surrounding the central core;
- a first semiconductor die bonded to the second region of the first substrate;
- and
- a semiconductor die package bonded to the first substrate, wherein the first semiconductor die is between the package and the first substrate, and wherein the semiconductor die package comprises a connector bonded to the bump, and further comprising an air gap between an exposed surface of the first semiconductor die and the semiconductor die package.
A method of forming a package structure, comprising:
- forming a plurality of bumps on a first region of a first substrate, wherein each of the plurality of bumps comprises a metallic ball, a solder material surrounding the metal ball, and a plurality of minor elements dispersed in the metallic ball;
- bonding a first semiconductor die to the first substrate in a region surrounded by the plurality of bumps;
- providing a molded underfill material layer on the first substrate, and exposing top portions of the first semiconductor die and the plurality of bumps and leaving an air gap above the first semiconductor die;
- and
- bonding a semiconductor die package to a second region of the first substrate, wherein the first semiconductor die is between the package and the first substrate and wherein the semiconductor die package comprises a plurality of connectors respectively bonded to the plurality of bumps.
A package structure, comprising:
- a semiconductor substrate comprises an interconnect structure;
- a plurality of first conductive pads and a plurality of second conductive pads formed on opposite sides of the semiconductor substrate and electrically connected to the interconnect structure;
- a plurality of bumps formed overlying and electrically connected to the first conductive pads, wherein at least one of the plurality of bumps comprises a metallic ball and a plurality of minor elements dispersed in the metallic structure wherein the metallic structure comprises a central core formed of a metal material and a solder material layer surrounding the central core;
- and
- a semiconductor die bonded to the semiconductor substrate in a region surrounded by the plurality of bumps.
Dependencies are inferred from the claim text.