H10W 72/221
Structures or relative sizes
Official title: {Structures or relative sizes}
H10W72/221 (Structures or relative sizes) appears on 7,453 US grants and 9,095 published applications in this corpus.
Search patents in H10W- Granted patents
- 7,453
- Published applications
- 9,095
- Assignees
- 1,053
- Inventors
- 10,092
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 4 | 0 |
| 1991 | 3 | 0 |
| 1992 | 5 | 0 |
| 1993 | 9 | 0 |
| 1994 | 9 | 0 |
| 1995 | 11 | 0 |
| 1996 | 10 | 0 |
| 1997 | 21 | 0 |
| 1998 | 31 | 0 |
| 1999 | 50 | 0 |
| 2000 | 45 | 0 |
| 2001 | 72 | 48 |
| 2002 | 83 | 104 |
| 2003 | 87 | 95 |
| 2004 | 87 | 133 |
| 2005 | 84 | 201 |
| 2006 | 102 | 146 |
| 2007 | 112 | 202 |
| 2008 | 108 | 205 |
| 2009 | 132 | 252 |
| 2010 | 163 | 262 |
| 2011 | 225 | 314 |
| 2012 | 244 | 364 |
| 2013 | 321 | 453 |
| 2014 | 350 | 488 |
| 2015 | 455 | 528 |
| 2016 | 464 | 458 |
| 2017 | 505 | 477 |
| 2018 | 438 | 430 |
| 2019 | 436 | 551 |
| 2020 | 502 | 610 |
| 2021 | 426 | 578 |
| 2022 | 469 | 558 |
| 2023 | 436 | 420 |
| 2024 | 422 | 472 |
| 2025 | 345 | 458 |
| 2026 | 176 | 288 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Metal pillar for conductive connection6 Oct 2026US 12,757,750 B2Duksan Hi-Metal Co., Ltd.
- Wiring board, semiconductor device, and method for manufacturing semiconductor device6 Oct 2026US 12,757,762 B2Kioxia Corporation
- Patterned sheet MUF for complex packages and methods of producing6 Oct 2026US 12,757,781 B2Intel Corporation
- Package structure with wettable side surface and manufacturing method thereof, and vertical package module6 Oct 2026US 12,757,784 B2Zhuhai ACCESS Semiconductor Co., Ltd.
- Semiconductor package and method of manufacturing the same6 Oct 2026US 12,757,796 B2Samsung Electronics Co., Ltd.
- Package structure and method for forming the same8 Oct 2026US 2026/0313918 A1Taiwan Semiconductor Manufacturing Company.Ltd
- High-density interconnect region with mixed bump widths8 Oct 2026US 2026/0314440 A1Intel Corporation
- Flip-chip package with pre-molded leadframe8 Oct 2026US 2026/0314454 A1Navitas Semiconductor Limited
- Microelectronics package with hybrid connection to a substrate to enable reuse8 Oct 2026US 2026/0314461 A1NXP B. V.
- Microelectronic assemblies8 Oct 2026US 2026/0314496 A1Intel Corporation
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Package of integrated circuits and vertical integration749US 6,322,903 B1Tru-Si Technologies, Inc. · 2001