H10W 72/222
Multilayered bumps
Official title: {Multilayered bumps, e.g. a coating on top and side surfaces of a bump core}
H10W72/222 (Multilayered bumps) appears on 3,510 US grants and 4,232 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,510
- Published applications
- 4,232
- Assignees
- 594
- Inventors
- 5,087
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 4 | 0 |
| 1996 | 3 | 0 |
| 1997 | 6 | 0 |
| 1998 | 14 | 0 |
| 1999 | 20 | 0 |
| 2000 | 15 | 0 |
| 2001 | 29 | 17 |
| 2002 | 30 | 41 |
| 2003 | 24 | 36 |
| 2004 | 30 | 34 |
| 2005 | 24 | 56 |
| 2006 | 28 | 54 |
| 2007 | 34 | 62 |
| 2008 | 35 | 83 |
| 2009 | 38 | 91 |
| 2010 | 55 | 84 |
| 2011 | 76 | 144 |
| 2012 | 95 | 169 |
| 2013 | 146 | 245 |
| 2014 | 178 | 249 |
| 2015 | 226 | 263 |
| 2016 | 251 | 220 |
| 2017 | 256 | 251 |
| 2018 | 214 | 201 |
| 2019 | 224 | 289 |
| 2020 | 261 | 319 |
| 2021 | 238 | 305 |
| 2022 | 238 | 289 |
| 2023 | 232 | 209 |
| 2024 | 218 | 230 |
| 2025 | 173 | 194 |
| 2026 | 82 | 97 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Metal pillar for conductive connection6 Oct 2026US 12,757,750 B2Duksan Hi-Metal Co., Ltd.
- Wiring board, semiconductor device, and method for manufacturing semiconductor device6 Oct 2026US 12,757,762 B2Kioxia Corporation
- Semiconductor package and method of manufacturing the same6 Oct 2026US 12,757,796 B2Samsung Electronics Co., Ltd.
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Semiconductor package including support member22 Sep 2026US 12,745,643 B2Samsung Electronics Co., Ltd.
- Microelectronics package with hybrid connection to a substrate to enable reuse8 Oct 2026US 2026/0314461 A1NXP B. V.
- Logic drive using standard commodity programmable logic ic chips comprising non-volatile random access memory cells1 Oct 2026US 2026/0303097 A1iCometrue Company Ltd.
- Semiconductor packages with separately plated metal pillars1 Oct 2026US 2026/0305410 A1Texas Instruments Incorporated
- Multi-layer metal stack for wire bonding1 Oct 2026US 2026/0305453 A1
- Semiconductor device packages and methods of formation17 Sep 2026US 2026/0282398 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Package of integrated circuits and vertical integration749US 6,322,903 B1Tru-Si Technologies, Inc. · 2001
- Multi-chip programmable logic device having configurable logic circuitry and configuration data storage on different dice399US 6,917,219 B2Xilinx, Inc. · 2005
- Pillar connections for semiconductor chips and method of manufacture392US 6,578,754 B1Advanpack Solutions Pte Ltd. · 2003