H10W 72/223
Characterised by the structure of the outermost layers
Official title: {characterised by the structure of the outermost layers, e.g. multilayered coatings}
H10W72/223 (Characterised by the structure of the outermost layers) appears on 770 US grants and 959 published applications in this corpus.
Search patents in H10W- Granted patents
- 770
- Published applications
- 959
- Assignees
- 262
- Inventors
- 1,622
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 7 | 0 |
| 1999 | 13 | 0 |
| 2000 | 7 | 0 |
| 2001 | 10 | 8 |
| 2002 | 15 | 18 |
| 2003 | 10 | 11 |
| 2004 | 10 | 12 |
| 2005 | 6 | 21 |
| 2006 | 9 | 30 |
| 2007 | 14 | 21 |
| 2008 | 12 | 33 |
| 2009 | 16 | 25 |
| 2010 | 26 | 34 |
| 2011 | 40 | 49 |
| 2012 | 33 | 45 |
| 2013 | 45 | 55 |
| 2014 | 37 | 45 |
| 2015 | 42 | 59 |
| 2016 | 49 | 44 |
| 2017 | 51 | 54 |
| 2018 | 43 | 36 |
| 2019 | 45 | 44 |
| 2020 | 36 | 44 |
| 2021 | 29 | 47 |
| 2022 | 36 | 49 |
| 2023 | 36 | 45 |
| 2024 | 31 | 58 |
| 2025 | 32 | 42 |
| 2026 | 20 | 30 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Metal pillar for conductive connection6 Oct 2026US 12,757,750 B2Duksan Hi-Metal Co., Ltd.
- Semiconductor package and method of manufacturing the same6 Oct 2026US 12,757,796 B2Samsung Electronics Co., Ltd.
- Semiconductor device with a surface of a semiconductor body exposed through an opening in a sealing resin11 Aug 2026US 12,707,995 B2Rohm Co., Ltd.
- Double-sided heat dissipation power semiconductor module and method of manufacturing the same4 Aug 2026US 12,702,002 B2Lx Semicon Co., Ltd.
- Semiconductor package28 Jul 2026US 12,696,814 B2Samsung Electronics Co., Ltd.
- Microelectronics package with hybrid connection to a substrate to enable reuse8 Oct 2026US 2026/0314461 A1NXP B. V.
- Semiconductor packages with separately plated metal pillars1 Oct 2026US 2026/0305410 A1Texas Instruments Incorporated
- Semiconductor device assembly interconnection pillars and associated methods17 Sep 2026US 2026/0282991 A1Micron Technology, Inc.
- Connecting pillar17 Sep 2026US 2026/0282992 A1Duksan Hi-Metal Co., Ltd.
- Differential contrast plating for advanced packaging applications3 Sep 2026US 2026/0258571 A1Lam Research Corporation
Most cited
By later US patents
- Package of integrated circuits and vertical integration749US 6,322,903 B1Tru-Si Technologies, Inc. · 2001
- Packaging of integrated circuits and vertical integration329US 6,693,361 B1Tru-Si Technologies, Inc. · 2004
- Method of mounting resilient contact structures to semiconductor devices254US 5,829,128 AFormFactor, Inc. · 1998
- Method of making microelectronic spring contact elements226US 6,184,053 B2FormFactor, Inc. · 2001
- Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bonding214US 8,546,956 B2International Business Machines Corporation · 2013