Semiconductor device with a surface of a semiconductor body exposed through an opening in a sealing resin
AssigneeRohm Co., Ltd.
InventorKengo Ohmori
Life of this patent
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Abstract
A semiconductor device includes a conductor, a semiconductor element, and a sealing resin. The conductor has an obverse surface facing in the thickness direction. The semiconductor element includes an element body and a plurality of electrodes connected to the element body and bonded to the obverse surface. The sealing resin covers the semiconductor element. The sealing resin has a top surface facing the same side as the obverse surface in the thickness direction, and an opening penetrating the top surface in the thickness direction. The element body is exposed through the opening.
Claims20
A semiconductor device comprising:
- a conductor having an obverse surface facing in a thickness direction;
- a semiconductor element including an element body and a plurality of electrodes, the plurality of electrodes being connected to the element body and bonded to the obverse surface;
- and
- a sealing resin covering the semiconductor element, wherein
- the sealing resin has a top surface and an opening, the top surface facing a same side as the obverse surface in the thickness direction, the opening penetrating the top surface in the thickness direction,
- the element body includes:
- a substrate made of a semiconductor material;
- and a semiconductor layer located closer to the obverse surface than is the substrate in the thickness direction and electrically connected to the plurality of electrodes,
- the substrate has a base surface facing the same side as the obverse surface in the thickness direction,
- the base surface is exposed through the opening,
- the base surface is located closer to the obverse surface than is the top surface in the thickness direction,
- the top surface includes an opening edge defining the opening in a manner such that the opening overlaps but extends beyond the base surface as viewed in the thickness direction,
- the sealing resin has as an opening surface connected to the opening edge and defining the opening,
- the opening surface includes a first section located between the top surface and the obverse surface in the thickness direction and parallel to the top surface, and a second section connected to the first section and the opening edge,
- the second section is inclined with respect to both the first section and the top surface,
- an area of the opening as viewed in the thickness direction gradually reduces from the top surface toward the base surface,
- the first section is flanked by the base surface and the second section in a first direction orthogonal to the thickness direction, and
- a dimension of the first section in the first direction is smaller than a dimension of the second section in the thickness direction.
A semiconductor device comprising:
- a conductor having an obverse surface facing in a thickness direction;
- a semiconductor element including an element body and a plurality of electrodes, the plurality of electrodes being connected to the element body and bonded to the obverse surface;
- and
- a sealing resin covering the semiconductor element, wherein
- the sealing resin has a top surface and an opening, the top surface facing a same side as the obverse surface in the thickness direction, the opening penetrating the top surface in the thickness direction,
- the element body includes:
- a substrate made of a semiconductor material;
- and a semiconductor layer located closer to the obverse surface than is the substrate in the thickness direction and electrically connected to the plurality of electrodes,
- the substrate has a base surface facing the same side as the obverse surface in the thickness direction,
- the base surface is exposed through the opening,
- the conductor includes a plurality of first leads and a plurality of second leads,
- the plurality of first leads are elongated in a first direction orthogonal to the thickness direction and spaced apart from each other in a second direction orthogonal to the thickness direction and the first direction,
- the plurality of second leads are spaced apart from the plurality of first leads in the second direction,
- the plurality of first leads and the plurality of second leads each have a reverse surface opposite to the obverse surface in the thickness direction,
- the plurality of first leads include an input terminal to which direct voltage is applied,
- the input terminal includes a main section elongated in the first direction and a pair of side sections connected to opposite ends of the main section in the first direction,
- each of the side sections includes an end surface connected to the obverse surface and the reverse surface of the input terminal, the end surface facing in the first direction,
- each of the side sections is formed with a constriction, and
- in each of the side sections, the constriction causes a dimension of the end surface in the second direction to be smaller than a dimension of the reverse surface of the main section in the second direction.
Dependencies are inferred from the claim text.