Connecting pillar
AssigneeDuksan Hi-Metal Co., Ltd.
InventorsEun Dong Jin, LEE HYUNKYU, Kim Kyung Tae, Bae Sung Moon, Park Eun Kwang, Seong Taek Kim, Kim Jin-Gyu, CHU YONGCHEOL, Oh Heebong
Life of this patent
Estimating the term…
Abstract
An aspect of the present invention provides a metal pillar in a columnar shape formed by cutting a metal wire to a predetermined length. The metal pillar has a burr length of 0.1 to 0.5 μm on the cutting surface and provide a connecting pillar that has a solder layer on at least one area of the outer surface of the metal pillar, which comprises Sn, Cu, and Ag.
Claims15
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
The manufacturing method for the connecting pillar comprises the following:
- melting process of melting by including additive elements in the molten solution of base metal;
- strand process of producing strands or slices performing rolling, pressing or stranding from the melt after the melting process;
- wire drawing process of drawing from the strands or slices into wire;
- heat treatment process of heating the drawn wire at a temperature ranging from 160 to 300° C.;
- and
- cutting process of cutting the metal wire into a predetermined length to make metal pillars having a diameter of 50 to 300 μm and a height of 60 to 3,000 μm;
- and
- solder layer forming process of forming a solder layer by electroplating a metal containing Sn on the surface of the metal pillar.
Dependencies are inferred from the claim text.