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US 12,696,814 B2Granted
Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsYoung-Ja Kim, Sunwon Kang, Mi-Na Choi
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a first substrate. A second substrate is spaced apart from the first substrate. A semiconductor chip is between the first substrate and the second substrate. The semiconductor chip is electrically connected to the second substrate. A molding layer surrounds the semiconductor chip. A plate directly contacts a bottom surface of the semiconductor chip. A heat transfer structure connects the plate and the first substrate to each other.
Claims20
A semiconductor package, comprising:
- a first substrate;
- a second substrate spaced apart from the first substrate;
- a semiconductor chip between the first substrate and the second substrate, the semiconductor chip is electrically connected to the second substrate;
- a molding layer surrounding the semiconductor chip;
- a plate directly contacting a bottom surface of the semiconductor chip;
- and
- a heat transfer structure connecting the plate and the first substrate to each other.
4 more elements
A semiconductor package, comprising:
- a first substrate;
- a second substrate spaced apart from the first substrate;
- a semiconductor chip between the first substrate and the second substrate, the semiconductor chip is electrically connected to the second substrate;
- a molding layer surrounding the semiconductor chip;
- a plate directly contacting a bottom surface of the semiconductor chip;
- and
- a connection conductive structure between the first substrate and the second substrate, the connection conductive structure electrically connecting the first substrate and the second substrate to each other,
- wherein a bottom surface of the molding layer includes:
- a first portion directly contacting a top surface of the plate;
- and
- a second portion spaced apart from the plate and exposed by an empty space, the empty space is positioned between the molding layer and the first substrate.
8 more elements
A semiconductor package, comprising:
- a first substrate;
- a second substrate spaced apart from the first substrate;
- a first semiconductor chip between the first substrate and the second substrate;
- a first molding layer surrounding the first semiconductor chip;
- a plate directly contacting a bottom surface of the first semiconductor chip and a bottom surface of the first molding layer;
- a through via penetrating the first molding layer and connecting the second substrate to the plate;
- a connection conductive structure electrically connecting the first substrate to the second substrate;
- a heat transfer structure directly contacting a bottom surface of the plate and a top surface of the first substrate;
- a second semiconductor chip electrically connected to the second substrate;
- and
- a second molding layer surrounding the second semiconductor chip.
8 more elements
Dependencies are inferred from the claim text.