Multi-chip programmable logic device having configurable logic circuitry and configuration data storage on different dice

A method of forming a device, comprising:

• stacking a first structure and a second structure together, the first structure physically separable from the second structure, and electrically connecting the first structure to the second structure such that a configuration data bit maintained on the second structure is communicated to the first structure, the configuration data bit configuring configurable logic on the first structure, wherein one of the first and second structures includes a protruding alignment feature, and the other of the first and second structures includes a recessed alignment feature, the protruding alignment feature engaging the recessed alignment feature when the first structure and the second structure are stacked together.

An integrated circuit, comprising:

• a programmable logic portion including a plurality of configurable elements;
• and
• a plurality of micropads disposed across a surface of the integrated circuit, each of the micropads being coupled to a corresponding one of the plurality of configurable elements, wherein at least some of the plurality of micropads are one of protruding micropads and recessed micropads.

A method of forming an integrated circuit device comprising:

• providing a first device having configurable circuitry for implementing a logic function and a plurality of first micropads disposed in a pattern on a surface of the first device;
• providing a second device having circuitry for providing configuration signals and a plurality of second micropads disposed in the pattern, the second device being adapted to be coupled to the surface of the first device in a stacked relation such that each of the first micropads on the first device couples with a corresponding one of the second micropads on the second device wherein at least some of the plurality of micropads are one of protruding micoropads and recessed micropads.

A method, comprising:

• coupling a first device having configurable logic to a second device having structure for providing configuration data bits in a stacked relation such that the configuration data bits stored on the second device are communicated from the second device to the configurable logic on the first device such that the configurable logic on the first device is configured to realize a user-defined circuit;
• and
• providing a third device having the configurable logic of the first device and further structure supplying each of the data bits of the second device such that the third device implements the same user-defined circuit as does the first device.

A method of forming a device, comprising:

• stacking a first die and a second die together and electrically connecting the first die to the second die such that a configuration data bit maintained on the second die is communicated to the first die, the configuration data bit configuring configurable logic on the first die;
• wherein one of the first and second dice includes a protruding alignment feature, and wherein the other of the first and second dice includes a recessed alignment feature, the protruding alignment feature engaging the recessed alignment feature when the first die and second die are stacked together.