H10W 72/228
Multiple bumps having different structures
Official title: {Multiple bumps having different structures}
H10W72/228 (Multiple bumps having different structures) appears on 120 US grants and 141 published applications in this corpus.
Search patents in H10W- Granted patents
- 120
- Published applications
- 141
- Assignees
- 57
- Inventors
- 253
- Latest grant
- 23 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 2 |
| 2003 | 0 | 0 |
| 2004 | 1 | 1 |
| 2005 | 0 | 7 |
| 2006 | 3 | 0 |
| 2007 | 2 | 3 |
| 2008 | 0 | 3 |
| 2009 | 0 | 1 |
| 2010 | 0 | 2 |
| 2011 | 2 | 2 |
| 2012 | 3 | 5 |
| 2013 | 4 | 4 |
| 2014 | 4 | 11 |
| 2015 | 6 | 15 |
| 2016 | 15 | 11 |
| 2017 | 10 | 11 |
| 2018 | 17 | 11 |
| 2019 | 6 | 6 |
| 2020 | 8 | 9 |
| 2021 | 7 | 11 |
| 2022 | 9 | 9 |
| 2023 | 6 | 5 |
| 2024 | 7 | 6 |
| 2025 | 7 | 3 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device23 Jun 2026US 12,666,975 B2Rohm Co., Ltd.
- Integrated circuit component and package structure having the same11 Nov 2025US 12,469,753 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Chip package and method of manufacturing the same7 Oct 2025US 12,438,060 B2Unimicron Technology Corp.
- Method of forming an electronic device structure having an electronic component with an on-edge orientation and related structures13 May 2025US 12,300,638 B2Amkor Technology Singapore Holding Pte.Ltd.
- Substrate and package structure13 May 2025US 12,300,652 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Flip-chip package with pre-molded leadframe8 Oct 2026US 2026/0314454 A1Navitas Semiconductor Limited
- Semiconductor device17 Sep 2026US 2026/0282947 A1Rohm Co., Ltd.
- Hybird bump structures2 Jul 2026US 2026/0191074 A1
- Dual interface silicon stack20 Nov 2025US 2025/0357305 A1Advanced Micro Devices, Inc.
- Microelectronic assemblies10 Jul 2025US 2025/0226332 A1Intel Corporation
Most cited
By later US patents
- Semiconductor package and fabrication method thereof185US 9,786,586 B1Micron Technology, Inc. · 2017
- Stackable molded microelectronic packages119US 8,482,111 B2Tessera, Inc. · 2013
- Stackable molded microelectronic packages65US 9,123,664 B2Tessera, Inc. · 2015
- Stackable molded microelectronic packages60US 8,907,466 B2Tessera, Inc. · 2014
- Structure and method of making sealed capped chips49US 7,298,030 B2Tessera, Inc. · 2007