Method of forming an electronic device structure having an electronic component with an on-edge orientation and related structures

An electronic device structure, comprising:

• a substrate comprising a substrate first major surface, an opposing substrate second major surface, and a first conductive pattern adjacent to the substrate first major surface;
• a first electronic component coupled to the substrate and comprising a first component first side and a first active surface adjacent to the first component first side;
• a second electronic component adjacent to the substrate second major surface and comprising a second component first side and a second active surface adjacent to the second component first side;
• and
• a third electronic component coupled to the substrate;
• wherein:
• the first electronic component is substantially orthogonal to the substrate and the first active surface is oriented in a first direction;
• the second active surface is oriented in a second direction different than the first direction;
• the third electronic component comprises a third component first side and a third active surface adjacent to the third component first side;
• the third active surface is oriented in a third direction different than the first direction and the second direction;
• the third electronic component comprises a third component second side opposite to the third component first side;
• the third component second side is attached to the first conductive pattern with conductive bumps;
• and
• the first active surface and the second active surface comprise antennas.

An electronic device structure, comprising:

• a substrate comprising a substrate first major surface, an opposing substrate second major surface, and a substrate conductive pattern adjacent the substrate first major surface;
• a first antenna structure substantially orthogonal to and coupled to the substrate and oriented in a first direction;
• a second antenna structure located proximate the substrate second major surface and oriented in a second direction different from the first direction;
• an electronic component coupled to the substrate at the substrate first major surface and comprising a component first major surface;
• and
• a package body encapsulating the first antenna structure and the electronic component but not the second antenna structure, wherein:
• the third electronic component comprises a third antenna structure oriented in a third direction different from the first direction and the second direction.

An electronic device structure comprising:

• a substrate comprising a substrate first major surface, an opposing substrate second major surface, and a first conductive pattern adjacent to the substrate first major surface;
• a first electronic component coupled to the substrate and comprising a first component first side and a first active surface adjacent to the first component first side;
• a second electronic component adjacent to the substrate second major surface and comprising a second component first side and a second active surface adjacent to the second component first side;
• a third electronic component coupled to the substrate;
• and
• a package body over the third electronic component;
• wherein:
• the first electronic component is substantially orthogonal to the substrate and the first active surface is oriented in a first direction;
• the second active surface is oriented in a second direction different than the first direction;
• the third electronic component comprises a third component first side and a third active surface adjacent to the third component first side;
• the third active surface is oriented in a third direction different than the first direction and the second direction;
• the third electronic component comprises a third component second side opposite to the third component first side;
• and
• the third component second side is attached to the first conductive pattern with conductive bumps.