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US 12,300,652 B2Granted
Substrate and package structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu
Life of this patent
Estimating the term…
Abstract
According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.
Claims20
A device comprising:
- a substrate comprising:
- first pads in a first area of the substrate;
- and
- second pads in a second area of the substrate, the second area extending around the first area in a top-down view, the second pads having a lesser width than the first pads in a cross-sectional view;
- and
- a chip comprising bumps, each of the bumps having a substantially same width in the cross-sectional view, a first subset of the bumps connected to the first pads of the substrate, a second subset of the bumps connected to the second pads of the substrate.
3 more elements
A device comprising:
- a substrate comprising:
- first pads in a core area of the substrate;
- and
- second pads in other areas of the substrate except the core area;
- and
- a chip comprising bumps, the bumps having a substantially same width as the first pads, the bumps having a larger width than the second pads, a first subset of the bumps connected to the first pads of the substrate, a second subset of the bumps connected to the second pads of the substrate.
3 more elements
A device comprising:
- a substrate comprising:
- first traces in a core area of the substrate, the first traces each having a first width and having a first length, the first length greater than the first width;
- and
- second traces in other areas of the substrate except the core area, the second traces each having a second width and having a second length, the second length greater than the second width;
- and
- a chip comprising bumps, a first subset of the bumps connected to the first traces of the substrate, a second subset of the bumps connected to the second traces of the substrate, the bumps each having a third width, a ratio of the first width to the third width being greater than a ratio of the second width to the third width.
3 more elements
Dependencies are inferred from the claim text.