H10W 72/224
Bumps having multiple side-by-side cores
Official title: {Bumps having multiple side-by-side cores}
H10W72/224 (Bumps having multiple side-by-side cores) appears on 388 US grants and 435 published applications in this corpus.
Search patents in H10W- Granted patents
- 388
- Published applications
- 435
- Assignees
- 147
- Inventors
- 811
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 4 | 0 |
| 2000 | 3 | 0 |
| 2001 | 5 | 2 |
| 2002 | 2 | 2 |
| 2003 | 2 | 0 |
| 2004 | 2 | 6 |
| 2005 | 1 | 10 |
| 2006 | 4 | 10 |
| 2007 | 9 | 16 |
| 2008 | 8 | 10 |
| 2009 | 11 | 13 |
| 2010 | 9 | 13 |
| 2011 | 11 | 15 |
| 2012 | 14 | 27 |
| 2013 | 17 | 41 |
| 2014 | 28 | 42 |
| 2015 | 41 | 30 |
| 2016 | 34 | 23 |
| 2017 | 36 | 28 |
| 2018 | 26 | 26 |
| 2019 | 14 | 16 |
| 2020 | 23 | 19 |
| 2021 | 17 | 20 |
| 2022 | 14 | 23 |
| 2023 | 19 | 15 |
| 2024 | 15 | 10 |
| 2025 | 9 | 12 |
| 2026 | 3 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Sintered metal flip chip joints18 Aug 2026US 12,713,938 B2Texas Instruments Incorporated
- Half-buried electrical connection insert rod device28 Apr 2026US 12,616,054 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Semiconductor structure and method for forming the same and semiconductor device7 Apr 2026US 12,599,023 B2Winbond Electronics Corp.
- Chip structure and method for forming the same4 Nov 2025US 12,463,166 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Low temperature direct copper-copper bonding23 Sep 2025US 12,424,453 B2Lam Research Corporation
- Semiconductor structure, semiconductor package, and method for forming semiconductor structure17 Sep 2026US 2026/0283006 A1CXMT Corporation
- Hybird bump structures2 Jul 2026US 2026/0191074 A1
- Under-bump metallization structure and methods of forming the same18 Jun 2026US 2026/0173940 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure18 Jun 2026US 2026/0173945 A1Advanced Semiconductor Engineering, Inc.
- Ring structure for interconnect structures and methods of forming the same11 Jun 2026US 2026/0165134 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method for fabricating a microelectronic fabrication having formed therein a redistribution structure165US 6,362,087 B1Aptos Corporation · 2002
- Solder mass having conductive encapsulating arrangement129US 5,130,779 AInternational Business Machines Corporation · 1992
- Structure for microelectronic packaging with bond elements to encapsulation surface126US 8,878,353 B2Invensas Corporation · 2014
- Interface structures for electronic devices123US 5,900,674 AGeneral Electric Company · 1999
- Interface structures for electronic devices94US 6,046,410 AGeneral Electric Company · 2000