Package structure

A package structure, comprising:

• a first substrate comprising a first pad;
• and
• a first conductive element disposed over the first pad, wherein the first conductive element has an upper surface and comprises an anisotropic crystal structure having the upper surface,
• wherein a cross-sectional width of a [111] crystallographic plane of the upper surface of the anisotropic crystal structure is greater than a cross-sectional width of a non-[111] crystallographic plane of the upper surface of the anisotropic crystal structure.

A package structure, comprising:

• a first substrate;
• a first seed layer over the first substrate and having a curved lateral surface;
• and
• a first conductive element disposed on the first seed layer and comprising an anisotropic crystal structure, wherein the first conductive element comprises a first portion contacting the curved lateral surface and having a [111] crystallographic plane non-parallel to an upper surface of the first conductive element, and the anisotropic crystal structure of the first conductive element further comprises a second portion spaced apart from the curved lateral surface of the first seed layer by the first portion.