Structure for microelectronic packaging with bond elements to encapsulation surface

A structure comprising:

• a substrate having first and second oppositely facing surfaces and a plurality of electrically conductive elements at the first surface;
• bond elements having bases joined to respective ones of the conductive elements at a first portion of the first surface and end surfaces remote from the substrate and the bases, each of the bond elements extending from the base to the end surface thereof;
• and
• a dielectric encapsulation element overlying and extending from the first portion of the first surface of the substrate and filling spaces between the bond elements such that the bond elements are separated from one another by the encapsulation element, the encapsulation element having a third surface facing away from the first surface of the substrate and having an edge surface extending from the third surface towards the first surface, wherein unencapsulated portions of the bond elements are defined by at least portions of the end surfaces of the bond elements that are uncovered by the encapsulation element at the third surface;
• wherein the encapsulation element at least partially defines a second portion of the first surface, the second portion being other than the first portion of the first surface and having an area sized to accommodate an entire area of a microelectronic element, and at least some of the conductive elements at the first surface are at the second portion and configured for connection with the microelectronic element, and
• wherein at least a portion of at least one of the bond elements adjacent the end surface thereof is perpendicular to the third surface.

A package assembly including a structure, wherein the structure includes:

• a substrate having first and second oppositely facing surfaces and a plurality of electrically conductive elements at the first surface;
• bond elements having bases joined to respective ones of the conductive elements at a first portion of the first surface and end surfaces remote from the substrate and the bases, each of the bond elements extending from the base to the end surface thereof;
• and
• a dielectric encapsulation element overlying and extending from the first portion of the first surface of the substrate and filling spaces between the bond elements such that the bond elements are separated from one another by the encapsulation element, the encapsulation element having a third surface facing away from the first surface of the substrate and having an edge surface extending from the third surface towards the first surface, wherein unencapsulated portions of the bond elements are defined by at least portions of the end surfaces of the bond elements that are uncovered by the encapsulation element at the third surface,
• wherein the encapsulation element at least partially defines a second portion of the first surface, the second portion being other than the first portion of the first surface and having an area sized to accommodate an entire area of a microelectronic element, and at least some of the conductive elements at the first surface are at the second portion and configured for connection with the microelectronic element;
• the package assembly further comprising:
• a first microelectronic element disposed over the second portion and electrically connected to at least one of the some of the conductive elements;
• and
• a dielectric mass covering the first microelectronic element and at least a part of the second portion, the dielectric mass defining a fourth surface remote from and facing away from the first surface, at least a part of the fourth surface extending over the microelectronic element and the second portion, the dielectric mass defining a second edge surface facing at least a part of the edge surface,
• wherein the dielectric mass is other than the encapsulation element.

A package assembly including a structure, wherein the structure includes:

• a substrate having first and second oppositely facing surfaces and a plurality of electrically conductive elements at the first surface;
• bond elements having bases joined to respective ones of the conductive elements at a first portion of the first surface and end surfaces remote from the substrate and the bases, each of the bond elements extending from the base to the end surface thereof;
• and
• a dielectric encapsulation element overlying and extending from the first portion of the first surface of the substrate and filling spaces between the bond elements such that the bond elements are separated from one another by the encapsulation element, the encapsulation element having a third surface facing away from the first surface of the substrate and having an edge surface extending from the third surface towards the first surface, wherein unencapsulated portions of the bond elements are defined by at least portions of the end surfaces of the bond elements that are uncovered by the encapsulation element at the third surface,
• wherein the encapsulation element at least partially defines a second portion of the first surface, the second portion being other than the first portion of the first surface and having an area sized to accommodate an entire area of a microelectronic element, and at least some of the conductive elements at the first surface are at the second portion and configured for connection with the microelectronic element;
• the package assembly further comprising:
• a first microelectronic element disposed over the second surface of the substrate and electrically connected with at least one of the conductive elements through at least one of a plurality of second conductive elements at the second surface;
• and
• a dielectric mass covering the first microelectronic element and at least a part of the second surface extending away from the first microelectronic element, the dielectric mass defining a fourth surface remote from and facing away from the second surface.

A structure comprising:

• a substrate having first and second oppositely facing surfaces and a plurality of electrically conductive elements at the first surface;
• bond elements having bases joined to respective ones of the conductive elements at a first portion of the first surface and end surfaces remote from the substrate and the bases, each of the bond elements extending from the base to the end surface thereof;
• and
• a dielectric encapsulation element overlying and extending from the first portion of the first surface of the substrate and filling spaces between the bond elements such that the bond elements are separated from one another by the encapsulation element, the encapsulation element having a third surface facing away from the first surface of the substrate and having an edge surface extending from the third surface towards the first surface, wherein unencapsulated portions of the bond elements are defined by at least portions of the end surfaces of the bond elements that are uncovered by the encapsulation element at the third surface;
• wherein the encapsulation element at least partially defines a second portion of the first surface, the second portion being other than the first portion of the first surface and having an area sized to accommodate an entire area of a microelectronic element, and at least some of the conductive elements at the first surface are at the second portion and configured for connection with the microelectronic element, and
• wherein the first portion of the first surface of the substrate that the encapsulation element overlies completely encloses the second portion of the first surface of the substrate.

A method of making a structure comprising:

• forming a dielectric encapsulation element on a substrate, the substrate having first and second oppositely facing surfaces and a plurality of electrically conductive elements at the first surface, and wherein bond elements are joined at bases thereof to respective ones of the conductive elements at a first portion of the first surface and end surfaces of the bond elements are remote from the substrate and the bases, each of the bond elements extending from the base to the end surface thereof,
• wherein the dielectric encapsulation element is formed overlying and extending from the first portion of the first surface of the substrate and filling spaces between the bond elements such that the bond elements are separated from one another by the encapsulation element, the encapsulation element having a third surface facing away from the first surface of the substrate and having an edge surface extending from the third surface towards the first surface, wherein unencapsulated portions of the bond elements are defined by at least portions of the end surfaces of the bond elements that are uncovered by the encapsulation element at the third surface, and
• wherein the encapsulation element at least partially defines a second portion of the first surface, the second portion being other than the first portion of the first surface and having an area sized to accommodate an entire area of a microelectronic element, and at least some of the conductive elements at the first surface are at the second portion and configured for connection with the microelectronic element,
• wherein the bond elements include at least one wire soldered at the base thereof to one of the conductive elements before the encapsulation element is formed on the substrate.

A structure comprising:

• an active die having first and second oppositely facing surfaces and a plurality of electrically conductive elements at the first surface;
• bond elements having bases joined to respective ones of the conductive elements at a first portion of the first surface and end surfaces remote from the die and the bases, each of the bond elements extending from the base to the end surface thereof;
• and
• a dielectric encapsulation element overlying and extending from the first portion of the first surface of the die and filling spaces between the bond elements such that the bond elements are separated from one another by the encapsulation element, the encapsulation element having a third surface facing away from the first surface of the die and having an edge surface extending from the third surface towards the first surface, wherein unencapsulated portions of the bond elements are defined by at least portions of the end surfaces of the bond elements that are uncovered by the encapsulation element at the third surface;
• wherein the encapsulation element at least partially defines a second portion of the first surface, the second portion being other than the first portion of the first surface and having an area sized to accommodate an entire area of a microelectronic element, and at least some of the conductive elements at the first surface are at the second portion and configured for connection with the microelectronic element.

A method of making a structure comprising:

• forming a dielectric encapsulation element on an active die provided at wafer level, the die having first and second oppositely facing surfaces and a plurality of electrically conductive elements at the first surface, and wherein bond elements are joined at bases thereof to respective ones of the conductive elements at a first portion of the first surface and end surfaces of the bond elements are remote from the substrate and the bases, each of the bond elements extending from the base to the end surface thereof,
• wherein the dielectric encapsulation element is formed overlying and extending from the first portion of the first surface of the die and filling spaces between the bond elements such that the bond elements are separated from one another by the encapsulation element, the encapsulation element having a third surface facing away from the first surface of the die and having an edge surface extending from the third surface towards the first surface, wherein unencapsulated portions of the bond elements are defined by at least portions of the end surfaces of the bond elements that are uncovered by the encapsulation element at the third surface, and
• wherein the encapsulation element at least partially defines a second portion of the first surface, the second portion being other than the first portion of the first surface and having an area sized to accommodate an entire area of a microelectronic element, and at least some of the conductive elements at the first surface are at the second portion and configured for connection with the microelectronic element.