Solder mass having conductive encapsulating arrangement

A solder interconnection comprising:

• a) a site for a first solder mass,
• b) a first solder mass on said site,
• c) a first electrically conductive material substantially encapsulating said first solder mass, and
• d) at least a second solder mass on said first electrically conductive material.

A solder interconnection comprising:

• a) a site for a first solder mass,
• b) a first solder mass on said site,
• c) a first electrically conductive material substantially encapsulating said first solder mass, and
• d) at least a second solder mass on said first electrically conductive material;
• wherein said electrically conductive material is a solder wettable material selected from the group comprising Co, Cu, Ni, Pd, Pt, Ru or alloys thereof, or a non-solder wettable material selected from a group comprising Be, Cr, Fe, Hf, Mo, Nb, Ta, Ti, V, W, Zr and alloys thereof.

A solder interconnection comprising:

• a) a site for a first solder mass,
• b) a first solder mass on said site,
• c) a first electrically conductive material substantially encapsulating said first solder mass, and
• d) at least a second solder mass on said first electrically conductive material;
• wherein said electrically conductive material comprises a multilayer stack X/Y/X, X/Y/Z, X/Y or X/Z, wherein said layer X or Z is a material selected from the group comprising Co, Cu, Ni, Pd, Pt, Ru and alloys thereof, and wherein said layer Y is either a solder wettable material selected from the group comprising Co, Cu, Ni, Pd, Pt, Ru and alloys thereof, or a non-solder wettable material selected from the group comprising Be, Cr, Fe, Hf, Mo, Nb, Ta, Ti, V, W, Zr and alloys thereof.

A solder interconnection comprising:

• a) a site for a first solder mass,
• b) a first solder mass on said site,
• c) a first electrically conductive material substantially encapsulating said first solder mass, and
• d) at least a second solder mass on said first electrically conductive material;
• wherein a second electrically conductive material substantially encapsulates said second solder mass, and at least a third solder mass is formed on said second electrically conductive material.