H10W 72/227
Multiple bumps having different sizes
Official title: {Multiple bumps having different sizes}
H10W72/227 (Multiple bumps having different sizes) appears on 2,449 US grants and 3,110 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,449
- Published applications
- 3,110
- Assignees
- 500
- Inventors
- 4,171
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 1 | 0 |
| 1995 | 5 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 10 | 0 |
| 1999 | 2 | 0 |
| 2000 | 13 | 0 |
| 2001 | 14 | 21 |
| 2002 | 24 | 29 |
| 2003 | 29 | 23 |
| 2004 | 25 | 43 |
| 2005 | 29 | 66 |
| 2006 | 33 | 33 |
| 2007 | 31 | 57 |
| 2008 | 29 | 53 |
| 2009 | 30 | 62 |
| 2010 | 45 | 64 |
| 2011 | 51 | 70 |
| 2012 | 66 | 94 |
| 2013 | 81 | 104 |
| 2014 | 98 | 146 |
| 2015 | 121 | 162 |
| 2016 | 141 | 148 |
| 2017 | 163 | 157 |
| 2018 | 159 | 152 |
| 2019 | 150 | 207 |
| 2020 | 160 | 228 |
| 2021 | 156 | 244 |
| 2022 | 195 | 231 |
| 2023 | 176 | 172 |
| 2024 | 184 | 195 |
| 2025 | 144 | 174 |
| 2026 | 68 | 175 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Package structure with wettable side surface and manufacturing method thereof, and vertical package module6 Oct 2026US 12,757,784 B2Zhuhai ACCESS Semiconductor Co., Ltd.
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Flip-chip field effect transistor layouts and structures29 Sep 2026US 12,751,077 B2Wolfspeed, Inc.
- Double-side-cooling power module29 Sep 2026US 12,751,337 B2Monolithic Power Systems, Inc.
- Display device including a light emitting element connected to a first pad electrode and a second pad electrode and manufacturing method thereof22 Sep 2026US 12,745,458 B2Samsung Display Co., Ltd.
- High-density interconnect region with mixed bump widths8 Oct 2026US 2026/0314440 A1Intel Corporation
- Flip-chip package with pre-molded leadframe8 Oct 2026US 2026/0314454 A1Navitas Semiconductor Limited
- Microelectronic assemblies8 Oct 2026US 2026/0314496 A1Intel Corporation
- Semiconductor device with advanced pad structure and method for forming same1 Oct 2026US 2026/0302085 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Warpage reset layer on land side of substrate1 Oct 2026US 2026/0305418 A1Intel Corporation
Most cited
By later US patents
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Substrate for packaging a semiconductor device370US 5,214,308 ASumitomo Electric Industries, Ltd. · 1993
- Method for forming elongated solder connections between a semiconductor device and a supporting substrate304US 4,545,610 AInternational Business Machines Corporation · 1985
- III-Phospide and III-Arsenide flip chip light-emitting devices299US 6,784,463 B2Lumileds Lighting U.S., LLC · 2004
- LED illumination apparatus and card-type LED illumination source287US 6,949,772 B2Matsushita Electric Industrial Co., Ltd. · 2005