Warpage reset layer on land side of substrate
AssigneeIntel Corporation
InventorsZiyin LIN, James BREYFOGLE, Rui ZHANG, Dingying David XU, Zhiguo QIAN
Life of this patent
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Abstract
Embodiments disclosed herein include an apparatus that includes a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, the first surface is curved. In an embodiment, the apparatus further includes a pad on the first surface of the substrate, and a pillar on the pad. In an embodiment, the pillar extends away from the substrate. In an embodiment the apparatus further includes a layer on the first surface of the substrate, where the layer embeds the pillar, and where an end of the pillar opposite from the pad is exposed.
Claims20
An apparatus, comprising:
- substrate with a first surface and a second surface opposite from the first surface, wherein the first surface is curved;
- a pad on the first surface of the substrate;
- a pillar on the pad, wherein the pillar extends away from the substrate;
- and
- a layer on the first surface of the substrate, wherein the layer embeds the pillar, and wherein an end of the pillar opposite from the pad is exposed.
A method, comprising:
- mounting a die to a first surface of a substrate;
- forming a pillar on a second surface of the substrate, wherein the second surface of the substrate is curved;
- forming a mold layer over the substrate that embeds the pillar;
- and
- recessing the mold layer to expose the pillar.
An electronic system, comprising:
- a board;
- a substrate coupled to the board, wherein the substrate comprises:
- a package substrate with a first surface that faces the board, wherein the first surface is curved;
- a mold layer over the first surface of the package substrate;
- and
- a pillar coupled to a pad on the first surface of the package substrate, wherein the pillar passes through a thickness of the mold layer, and wherein a second surface of the mold layer facing away from the package substrate is substantially flat;
- and
- a die coupled to a third surface of the package substrate that faces away from the first surface.
Dependencies are inferred from the claim text.