H10W 72/29
Bond pads specially adapted therefor
H10W72/29 (Bond pads specially adapted therefor) appears on 13,600 US grants and 15,400 published applications in this corpus.
Search patents in H10W- Granted patents
- 13,600
- Published applications
- 15,400
- Assignees
- 1,381
- Inventors
- 14,713
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 6 | 0 |
| 1990 | 8 | 0 |
| 1991 | 10 | 0 |
| 1992 | 17 | 0 |
| 1993 | 22 | 0 |
| 1994 | 38 | 0 |
| 1995 | 25 | 0 |
| 1996 | 31 | 0 |
| 1997 | 34 | 0 |
| 1998 | 61 | 0 |
| 1999 | 87 | 0 |
| 2000 | 109 | 0 |
| 2001 | 183 | 126 |
| 2002 | 245 | 289 |
| 2003 | 253 | 277 |
| 2004 | 244 | 327 |
| 2005 | 247 | 429 |
| 2006 | 230 | 394 |
| 2007 | 250 | 465 |
| 2008 | 294 | 574 |
| 2009 | 278 | 527 |
| 2010 | 414 | 638 |
| 2011 | 535 | 743 |
| 2012 | 559 | 803 |
| 2013 | 741 | 890 |
| 2014 | 839 | 956 |
| 2015 | 864 | 935 |
| 2016 | 917 | 753 |
| 2017 | 867 | 783 |
| 2018 | 734 | 670 |
| 2019 | 639 | 732 |
| 2020 | 713 | 909 |
| 2021 | 669 | 809 |
| 2022 | 616 | 719 |
| 2023 | 638 | 488 |
| 2024 | 575 | 506 |
| 2025 | 419 | 391 |
| 2026 | 168 | 267 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wafer-level hybrid bonded RF switch with redistribution layer6 Oct 2026US 12,757,792 B2Qorvo US, Inc.
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Nano-roughened interconnects for integrated circuit packages29 Sep 2026US 12,751,312 B2Intel Corporation
- Stacked chip scale semiconductor device29 Sep 2026US 12,751,326 B2SanDisk Technologies LLC
- Display device including a light emitting element connected to a first pad electrode and a second pad electrode and manufacturing method thereof22 Sep 2026US 12,745,458 B2Samsung Display Co., Ltd.
- Semiconductor packages and methods of manufacturing thereof8 Oct 2026US 2026/0314284 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Heat dissipation in semiconductor devices8 Oct 2026US 2026/0314410 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device including bump structure8 Oct 2026US 2026/0314462 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit structure and manufacturing method thereof8 Oct 2026US 2026/0314480 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor Device and Method of Forming Fan-Out Wafer Level CPO with Through Silicon Conductive Via1 Oct 2026US 2026/0299219 A1STATS ChipPAC Pte. Ltd.
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016