H10W 72/261
Functions other than electrical connecting
Official title: {Functions other than electrical connecting}
H10W72/261 (Functions other than electrical connecting) appears on 1,108 US grants and 1,304 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,108
- Published applications
- 1,304
- Assignees
- 346
- Inventors
- 2,305
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 4 | 0 |
| 1998 | 9 | 0 |
| 1999 | 5 | 0 |
| 2000 | 11 | 0 |
| 2001 | 16 | 8 |
| 2002 | 13 | 16 |
| 2003 | 14 | 17 |
| 2004 | 14 | 27 |
| 2005 | 21 | 25 |
| 2006 | 15 | 20 |
| 2007 | 16 | 28 |
| 2008 | 12 | 30 |
| 2009 | 14 | 17 |
| 2010 | 17 | 25 |
| 2011 | 25 | 21 |
| 2012 | 17 | 56 |
| 2013 | 38 | 58 |
| 2014 | 49 | 76 |
| 2015 | 67 | 100 |
| 2016 | 84 | 81 |
| 2017 | 73 | 83 |
| 2018 | 76 | 68 |
| 2019 | 63 | 70 |
| 2020 | 81 | 94 |
| 2021 | 59 | 93 |
| 2022 | 83 | 92 |
| 2023 | 72 | 58 |
| 2024 | 62 | 65 |
| 2025 | 50 | 51 |
| 2026 | 19 | 25 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Die-to-die power delivery22 Sep 2026US 12,745,622 B2Altera Corporation
- Semiconductor package15 Sep 2026US 12,740,496 B2Seiko Epson Corporation
- Package structure and method for fabricating the same1 Sep 2026US 12,727,477 B2Wistron Neweb Corp.
- Integrated circuit package18 Aug 2026US 12,713,964 B2STMicroelectronics (Grenoble 2) SAS
- Semiconductor device with blocks including units with a protection element and a bump connected to a main unit11 Aug 2026US 12,707,748 B2Sony Semiconductor Solutions Corporation
- Semiconductor device8 Oct 2026US 2026/0314463 A1Kabushiki Kaisha Toshiba
- Semiconductor package1 Oct 2026US 2026/0305356 A1Samsung Electronics Co., Ltd.
- Light emitting module and light system including the same10 Sep 2026US 2026/0271471 A1Seoul Viosys Co., Ltd.
- Memory system with direct chip attach memory die10 Sep 2026US 2026/0271804 A1Micron Technology, Inc.
- Semiconductor structure and manufacturing method threreof3 Sep 2026US 2026/0262528 A1Siliconware Precision Industries Co., Ltd.
Most cited
By later US patents
- Multi-chip programmable logic device having configurable logic circuitry and configuration data storage on different dice399US 6,917,219 B2Xilinx, Inc. · 2005
- Methods for surface attachment of flipped active componenets316US 8,889,485 B2Semprius, Inc. · 2014
- Three-dimensional device fabrication method248US 7,354,798 B2International Business Machines Corporation · 2008
- Flexible connectors for microelectronic elements192US 6,086,386 ATessera, Inc. · 2000
- Photolithographically patterned spring contact191US 5,613,861 AXerox Corporation · 1997