H10W 72/267
Multiple bump connectors having different functions
Official title: {Multiple bump connectors having different functions}
H10W72/267 (Multiple bump connectors having different functions) appears on 672 US grants and 833 published applications in this corpus.
Search patents in H10W- Granted patents
- 672
- Published applications
- 833
- Assignees
- 210
- Inventors
- 1,538
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 2 |
| 2002 | 3 | 4 |
| 2003 | 4 | 9 |
| 2004 | 8 | 11 |
| 2005 | 11 | 10 |
| 2006 | 7 | 6 |
| 2007 | 4 | 8 |
| 2008 | 6 | 15 |
| 2009 | 5 | 5 |
| 2010 | 8 | 13 |
| 2011 | 10 | 9 |
| 2012 | 7 | 32 |
| 2013 | 19 | 35 |
| 2014 | 37 | 49 |
| 2015 | 45 | 65 |
| 2016 | 58 | 51 |
| 2017 | 42 | 45 |
| 2018 | 49 | 48 |
| 2019 | 33 | 49 |
| 2020 | 56 | 62 |
| 2021 | 38 | 71 |
| 2022 | 60 | 65 |
| 2023 | 55 | 47 |
| 2024 | 49 | 52 |
| 2025 | 33 | 49 |
| 2026 | 18 | 21 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Semiconductor device with blocks including units with a protection element and a bump connected to a main unit11 Aug 2026US 12,707,748 B2Sony Semiconductor Solutions Corporation
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- Memory system with direct chip attach memory die10 Sep 2026US 2026/0271804 A1Micron Technology, Inc.
- Semiconductor structure and manufacturing method threreof3 Sep 2026US 2026/0262528 A1Siliconware Precision Industries Co., Ltd.
- Semiconductor device and manufacturing method thereof27 Aug 2026US 2026/0256019 A1Nanya Technology Corporation
- Semiconductor chip and semiconductor package including the same2 Jul 2026US 2026/0191075 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Three-dimensional device fabrication method248US 7,354,798 B2International Business Machines Corporation · 2008
- Semiconductor device and process for producing the same163US 4,764,804 AHitachi, Ltd. · 1988
- Semiconductor device and method of fabricating the same96US 6,573,598 B2Oki Electric Industry Co., Ltd. · 2003
- Semiconductor packages with integrated antenna and method of forming thereof88US 8,952,521 B2Infineon Technologies AG · 2015
- High-frequency chip packages70US 6,856,007 B2Tessera, Inc. · 2005