Back to results
US 12,740,496 B2Granted
Semiconductor package
AssigneeSeiko Epson Corporation
InventorMichiyoshi Takano
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes: a silicon interposer; a photosensitive resin disposed at the silicon interposer and including an opening portion; metal wiring disposed at the photosensitive resin and at the silicon interposer in the opening portion; a first bump disposed at the metal wiring in the opening portion; a semiconductor chip disposed above the first bump and including a pad electrically coupled to the first bump; and a second bump disposed at the metal wiring in a region that overlaps the photosensitive resin in a plan view.
Claims9
A semiconductor package comprising:
- a silicon interposer;
- a photosensitive resin disposed at the silicon interposer and including a first opening portion;
- a metal wiring positioned overtop the photosensitive resin at positions of the photosensitive resin located outside of the first opening portion and positioned overtop the silicon interposer at positions of the silicon interposer located within the first opening portion, the metal layer including a second opening located within the first opening;
- a first bump disposed at the metal wiring in the opening portion;
- a semiconductor chip disposed at the first bump and including a pad electrically coupled to the first bump;
- and
- a second bump disposed at the metal wiring in a region that overlaps the photosensitive resin in a plan view
- wherein an end portion of the photosensitive resin defining the first opening portion is positioned between an outer edge of the semiconductor chip and a first inner edge of the second bump that faces the first opening portion, and the end portion of the photosensitive resin is positioned outboard from a second inner edge of the metal wiring that defines the second opening portion.
5 more elements
Dependencies are inferred from the claim text.