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US 8,952,521 B2Granted
Semiconductor packages with integrated antenna and method of forming thereof
AssigneeInfineon Technologies AG
InventorsMaciej Wojnowski, Walter Hartner, Ottmar Geitner, Gottfried Beer, Klaus Pressel, Mehran Pour Mousavi
Life of this patent
Estimating the term…
Abstract
In one embodiment of the present invention, a semiconductor package includes a substrate having a first major surface and an opposite second major surface. A chip is disposed in the substrate. The chip includes a plurality of contact pads at the first major surface. A first antenna structure is disposed at the first major surface. A reflector is disposed at the second major surface.
Claims28
A semiconductor package comprising:
- a substrate having a first major surface and an opposite second major surface;
- a first chip disposed in the substrate, the first chip comprising a plurality of contact pads at the first major surface;
- a first antenna structure disposed in the substrate, wherein the first antenna structure is disposed at the first major surface, and wherein the reflector is disposed at the second major surface;
- and
- a reflector disposed in the substrate.
2 more elements
A semiconductor package comprising:
- a substrate having a first major surface and an opposite second major surface;
- a first chip disposed in the substrate, the first chip comprising a plurality of contact pads at the first major surface;
- a first antenna structure disposed in the substrate;
- and
- a reflector disposed in the substrate, wherein the antenna structure comprises a component configured to emit radiation in a direction perpendicular to the first major surface.
2 more elements
A semiconductor package comprising:
- a substrate having a first major surface and an opposite second major surface;
- a first chip disposed in the substrate, the first chip comprising a plurality of contact pads at the first major surface;
- a heatsink disposed over the first chip:
- a first antenna structure disposed in the substrate;
- and
- a reflector disposed in the substrate.
3 more elements
A semiconductor package comprising:
- a substrate having a first major surface and an opposite second major surface;
- a first chip disposed in the substrate, the first chip comprising a plurality of contact pads at the first major surface;
- a first antenna structure disposed in the substrate;
- a dielectric lens disposed over the first antenna structure:
- and
- a reflector disposed in the substrate.
3 more elements
A semiconductor package comprising:
- a substrate having a first major surface and an opposite second major surface;
- a first chip disposed in the substrate, the first chip comprising a plurality of contact pads at the first major surface;
- a first antenna structure disposed in the substrate;
- a first via bar disposed in the substrate, wherein the first antenna structure is disposed within the first via bar;
- and
- a reflector disposed in the substrate.
3 more elements
A semiconductor system comprising:
- a semiconductor package comprising
- a substrate comprising an encapsulant, the substrate having a first major surface and an opposite second major surface,
- a chip disposed in the substrate, the chip comprising a plurality of contact pads at the first major surface,
- a first antenna structure proximate the first major surface,
- a reflector proximate the second major surface, and
- a plurality of external contacts at the second major surface;
- and
- a printed circuit board having a front side and back side, the printed circuit board comprising
- contact pads at the front side electrically coupled to the plurality of external contacts, wherein the front side faces the second major surface of the semiconductor package.
6 more elements
A method of forming a semiconductor package, the method comprising:
- forming a reconstituted substrate comprising a first chip embedded in an encapsulant, the reconstituted substrate comprising a first major surface and an opposite second major surface, the first chip comprising a plurality of contact pads at the first major surface;
- forming a front side redistribution layer over the first major surface of the reconstituted substrate, the front side redistribution layer comprising an antenna structure;
- and
- forming a back side redistribution layer under the second major surface of the reconstituted substrate, the back side redistribution layer comprising a reflector.
1 more element
A method of forming a semiconductor package, the method comprising:
- forming a substrate having a first major surface and an opposite second major surface, the substrate comprising a first chip, the first chip comprising a plurality of contact pads at the first major surface;
- forming a first antenna structure in the substrate, wherein forming the first antenna structure comprises forming the first antenna structure within a first redistribution layer at the first major surface;
- and
- forming a reflector in the substrate.
1 more element
A method of forming a semiconductor package, the method comprising:
- forming a substrate having a first major surface and an opposite second major surface, the substrate comprising a first chip, the first chip comprising a plurality of contact pads at the first major surface;
- forming a first antenna structure in the substrate, wherein forming the first antenna structure comprises forming the first antenna structure within a via bar, the via bar being formed within the substrate;
- and
- forming a reflector in the substrate.
1 more element
Dependencies are inferred from the claim text.