Back to results
US 2026/0271804 A1Published application
Memory system with direct chip attach memory die
AssigneeMicron Technology, Inc.
InventorsAnil Kumar Maganti, Pankaj Ramesh Chandra Katiyar
Life of this patent
Estimating the term…
Abstract
Methods, systems, and devices for memory system with direct chip attach memory die are described. A memory module may be formed using direct chip attach techniques that directly couple a memory die with a module substrate. By directly coupling the memory die with the module substrate, a semiconductor package including a package substrate that serves as an interface between the memory die and the module substrate may be eliminated.
Claims25
An apparatus, comprising:
- a printed circuit board, comprising:
- an array of first pads along an edge of the printed circuit board corresponding to a first type of interface;
- an array of second pads on a surface of the printed circuit board corresponding to a second type of interface that is specific to a design of the printed circuit board;
- and
- one or more conductive traces that electrically couple at least one of the first pads with at least one of the second pads, wherein the one or more conductive traces have approximately vertical sidewalls within the printed circuit board;
- and
- an integrated circuit, comprising:
- a semiconductor die that is directly coupled with the array of second connection pads using an array of connection structures;
- and
- a memory cell.
7 more elements
A memory system, comprising:
- processing circuitry;
- and
- a memory module communicatively coupled with the processing circuitry, comprising:
- a substrate comprising an edge connector through which the memory module is communicatively coupled with the processing circuitry;
- and
- a memory die that is attached directly to the substrate using an interconnect, wherein the interconnect conjoins with a first connection pad on the substrate that has approximately vertical sidewalls and with a second connection pad on the memory die.
3 more elements
A method, comprising:
- receiving a memory die;
- and
- attaching the memory die directly to a memory module printed circuit board using an array of controlled collapse chip connections, wherein the memory module printed circuit board includes an array of connection pads having approximately vertical sidewalls, and wherein a pinout of an interface formed by the array of connection pads is specific to a design of the memory die.
Dependencies are inferred from the claim text.