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US 12,707,748 B2Granted
Semiconductor device with blocks including units with a protection element and a bump connected to a main unit
AssigneeSony Semiconductor Solutions Corporation
InventorAkihiko Murashima
Life of this patent
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Abstract
The present disclosure relates to a semiconductor device capable of reducing design load. Provided is a semiconductor device including: a first substrate; and a second substrate bonded to the first substrate with a bonding portion where a bump is bonded, in which the bump pairs up with a predetermined function to constitute a unit. The present disclosure is applicable to, for example, a photodetection device such as a solid-state imaging device.
Claims10
A semiconductor device, comprising:
- a first substrate, including:
- an input unit, wherein the input unit includes a protection element and a bump;
- an output unit, wherein the output unit includes a protection element and a bump;
- and
- a main circuit, wherein the main circuit is connected to the input unit and to the output unit;
- and
- a second substrate, including:
- an input unit, wherein the input unit includes a protection element and a bump;
- an output unit, wherein the output unit includes a protection element and a bump;
- and
- a main circuit, wherein the main circuit is connected to the input unit and to the output unit,
- wherein the second substrate is bonded to the first substrate with a bonding portion,
- wherein the bump of the input unit of the first substrate is bump bonded to the bump of the output unit of the second substrate,
- wherein the bump of the output unit of the first substrate is bump bonded to the bump of the input unit of the second substrate, and
- wherein the main circuit of the first substrate is operatively connected to the main circuit of the second substrate.
12 more elements
Dependencies are inferred from the claim text.