H10W 72/265
Providing thermal transfer
Official title: {Providing thermal transfer, e.g. thermal bumps}
H10W72/265 (Providing thermal transfer) appears on 191 US grants and 249 published applications in this corpus.
Search patents in H10W- Granted patents
- 191
- Published applications
- 249
- Assignees
- 80
- Inventors
- 465
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 0 | 1 |
| 2003 | 1 | 1 |
| 2004 | 0 | 2 |
| 2005 | 2 | 1 |
| 2006 | 1 | 3 |
| 2007 | 1 | 2 |
| 2008 | 1 | 3 |
| 2009 | 2 | 0 |
| 2010 | 2 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 3 |
| 2013 | 4 | 7 |
| 2014 | 4 | 15 |
| 2015 | 11 | 19 |
| 2016 | 25 | 23 |
| 2017 | 14 | 15 |
| 2018 | 18 | 22 |
| 2019 | 13 | 13 |
| 2020 | 18 | 25 |
| 2021 | 9 | 19 |
| 2022 | 16 | 20 |
| 2023 | 19 | 11 |
| 2024 | 13 | 18 |
| 2025 | 13 | 13 |
| 2026 | 4 | 12 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package15 Sep 2026US 12,740,496 B2Seiko Epson Corporation
- Package structure and method for fabricating the same1 Sep 2026US 12,727,477 B2Wistron Neweb Corp.
- Semiconductor structure for reducing RLC parasitic parameters and manufacturing method thereof21 Jul 2026US 12,690,439 B2Changxin Memory Technologies, Inc.
- Packaging device including bumps and method of manufacturing the same3 Mar 2026US 12,568,829 B2SK hynic Inc.
- Polymer layers embedded with metal pads for heat dissipation9 Sep 2025US 12,412,852 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device8 Oct 2026US 2026/0314463 A1Kabushiki Kaisha Toshiba
- Light emitting module and light system including the same10 Sep 2026US 2026/0271471 A1Seoul Viosys Co., Ltd.
- Memory system with direct chip attach memory die10 Sep 2026US 2026/0271804 A1Micron Technology, Inc.
- Semiconductor chip and semiconductor package including the same2 Jul 2026US 2026/0191075 A1Samsung Electronics Co., Ltd.
- Semiconductor device and method of manufacturing the same25 Jun 2026US 2026/0182463 A1Renesas Electronics Corporation
Most cited
By later US patents
- Three-dimensional device fabrication method248US 7,354,798 B2International Business Machines Corporation · 2008
- Semiconductor packages with integrated antenna and method of forming thereof88US 8,952,521 B2Infineon Technologies AG · 2015
- High-frequency chip packages70US 6,856,007 B2Tessera, Inc. · 2005
- Semiconductor packages with integrated antenna and methods of forming thereof63US 8,866,292 B2Infineon Technologies AG · 2014
- High-frequency chip packages37US 7,268,426 B2Tessera, Inc. · 2007