High-frequency chip packages
AssigneeTessera, Inc.
InventorsMichael Warner, Lee Smith, Belgacem Haba, Glenn Urbish, Masud Beroz, Teck-Gyu Kang
Life of this patent
Estimating the term…
Abstract
A packaged semiconductor chip includes features such as a chip carrier having a large thermal conductor which can be solder-bonded to a circuit panel so as to provide enhanced thermal conductivity to the circuit panel and electromagnetic shielding and a conductive enclosure which partially or completely surrounds the packaged chip to provide additional heat dissipation and shielding. The packaged unit may include both an active semiconductor chip and a passive element, desirably in the form of a chip, which includes resistors and capacitors. Inductors may be provided in whole or in part on the chip carrier.
Claims18
An assembly comprising:
- a packaged semiconductor chip including:
- (a) a first semiconductor chip having a front face, a rear face, edges bounding said faces and contacts exposed at said front face, each of the faces of said first chip has a first area;
- (b) a second chip, said second chip having front and rear surfaces and contacts on said front surface, at least some of said contacts on said second chip being electrically connected to at least some of said contacts on said first chip, said front surface of said second chip facing upwardly and confronting a face of said first chip;
- and
- (c) a chip carrier disposed below said rear surface of said second chip, said chip carrier having a bottom surface facing downwardly away from said second chip and having a plurality of terminals exposed at said bottom surface, at least some of said terminals being electrically connected to at least one of said chips, said chip carrier having an opening coinciding with at least a portion of said rear surface of said second chip, said portion having a second area larger than said first area;
- a circuit panel mounted to said bottom surface of said chip carrier, said circuit panel having a top surface and including a thermally conductive element having a mounting surface extending in directions parallel to said top surface;
- and
- a flowable thermally conductive material uniformly covering at least a substantial portion of said rear surface, said flowable thermally conductive material connecting said rear surface of said second chip to said mounting surface of said thermally conductive element and spacing said rear surface of said second chip from said mounting surface, such that said rear surface of said second chip thermally communicates with said circuit panel through said flowable thermally conductive material.
An assembly comprising:
- a packaged semiconductor chip including:
- (a) a first semiconductor chip having a front face, a rear face, edges bounding said faces and contacts exposed at said front face;
- (b) a second chip, said second chip having front and rear surfaces and contacts on said front surface, at least some of said contacts on said second chip being electrically connected to at least some of said contacts on said first chip, said front surface of said second chip facing upwardly and confronting a face of said first chip;
- and
- (c) a sheet-like chip carrier disposed below said rear surface of said second chip, said chip carrier having a thickness less than about 150 microns, a bottom surface facing downwardly away from said second chip and having a plurality of terminals exposed at said bottom surface, at least some of said terminals being electrically connected to at least one of said chips, said chip carrier having an opening coinciding with at least a portion of said rear surface of said second chip;
- a circuit panel mounted to said bottom surface of said chip carrier, said circuit panel having a top surface and including a thermally conductive element having a mounting surface extending in directions parallel to said top surface;
- and
- a flowable thermally conductive material uniformly covering at least a substantial portion of said rear surface, said flowable thermally conductive material connecting said rear surface of said second chip to said mounting surface of said thermally conductive element and spacing said rear surface of said second chip from said mounting surface, such that said rear surface of said second chip thermally communicates with said circuit panel through said flowable thermally conductive material.
An assembly as claimed in 5, further comprising one or more discrete passive electrical components electrically connected to the terminals of said chip carrier.
An assembly as claimed in 5, further comprising a plurality of discrete passive electrical components electrically connected to at least one of said chips.
Dependencies are inferred from the claim text.