Semiconductor packages with integrated antenna and methods of forming thereof

A semiconductor system comprising:

• a semiconductor package comprising
• a substrate comprising an encapsulant, the substrate having a first major surface and an opposite second major surface,
• a chip disposed in the substrate, the chip comprising a plurality of contact pads at the first major surface,
• a via bar proximate the chip disposed in the substrate,
• an antenna structure disposed on or in the via bar, the antenna structure connected to a contact pad of the chip by a redistribution layer, and
• a plurality of external contacts at the first major surface and/or the second major surface;
• and
• a printed circuit board having a front side and back side, the printed circuit board comprising contact pads at the front side electrically coupled to the plurality of external contacts of the semiconductor package.

A method of forming a semiconductor package, the method comprising:

• forming a substrate having a first major surface and an opposite second major surface, the substrate comprising a chip, the chip comprising a plurality of contact pads at the first major surface;
• embedding a first via bar having a first antenna structure proximate the chip;
• and
• connecting the antenna structure to a chip contact pad by a redistribution layer.