Integrated circuit package
AssigneeSTMicroelectronics (Grenoble 2) SAS
InventorsRomain Coffy, Younes Boutaleb
Life of this patent
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Abstract
An integrated circuit package includes a support substrate and a cover fastened on a first face of the support substrate. The cover and support substrate define a housing containing an electronic integrated circuit chip having a first face equipped with electrically conductive protruding elements. A first space between the cover and a second face of the electronic integrated circuit chip is filled with a first shape memory material in the austenitic state. A second space between each pair of electrically conductive protruding elements and electrically conductive contact pads of the support substrate is filled with a second shape memory material in the austenitic state.
Claims21
An integrated circuit package, comprising:
- a support substrate including a first face with electrically conductive contact pads and an insulating layer over the first face of the support substrate and including an opening extending through the insulating layer at each electrically conductive contact pad;
- a cover fastened on a first face of the support substrate and defining, with the support substrate, a housing;
- at least one electronic integrated circuit chip contained within the housing;
- wherein the at least one electronic integrated circuit chip has a first face equipped with electrically conductive protruding elements and a second face opposite to the first face;
- and
- a layer of a first shape memory material located within each opening of the insulating layer and in contact with the electrically conductive contact pad;
- wherein each electrically conductive protruding element of the at least one electronic integrated circuit chip extends into the opening of the insulating layer to make contact with the layer of the first shape memory material;
- and
- wherein the electrically conductive protruding elements are in electrical cooperation with the electrically conductive contact pads of the support substrate via the layers of the first shape memory material.
A method for manufacturing an integrated circuit package, comprising:
- a) providing at least one electronic integrated circuit chip having a first face equipped with electrically conductive protruding elements;
- b) providing a support substrate having a first face equipped with electrically conductive contact pads and an insulating layer over the first face of the support substrate and including an opening extending through the insulating layer at each electrically conductive contact pad;
- c) providing within each opening of the insulating layer and in contact with the electrically conductive contact pad a first layer of a first shape memory material in a martensitic state and having an initial thickness;
- d) deforming the first layer so as to give it a second thickness which is less than the initial thickness and depositing the first layer thus deformed on the electrically conductive contact pads;
- e) flipping the at least one electronic integrated circuit chip and causing the protruding elements to extend into the openings of the insulating layer to make contact with the first layer of the first shape memory material;
- f) fastening a cover on the first face of the support substrate;
- and
- g) heating the structure obtained in step f) to a temperature which is higher than a temperature of end of transition to an austenitic state of the first shape memory material so that the first layer expands in thickness to apply a pressure against on the electrically conductive protruding elements.
Dependencies are inferred from the claim text.