H10W 72/263
Providing mechanical bonding or support
Official title: {Providing mechanical bonding or support, e.g. dummy bumps}
H10W72/263 (Providing mechanical bonding or support) appears on 319 US grants and 407 published applications in this corpus.
Search patents in H10W- Granted patents
- 319
- Published applications
- 407
- Assignees
- 127
- Inventors
- 789
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 1 |
| 2002 | 2 | 1 |
| 2003 | 1 | 6 |
| 2004 | 6 | 3 |
| 2005 | 3 | 6 |
| 2006 | 4 | 2 |
| 2007 | 1 | 4 |
| 2008 | 3 | 4 |
| 2009 | 1 | 2 |
| 2010 | 3 | 6 |
| 2011 | 4 | 6 |
| 2012 | 3 | 19 |
| 2013 | 13 | 20 |
| 2014 | 21 | 24 |
| 2015 | 18 | 32 |
| 2016 | 24 | 26 |
| 2017 | 19 | 25 |
| 2018 | 24 | 21 |
| 2019 | 15 | 25 |
| 2020 | 30 | 30 |
| 2021 | 22 | 38 |
| 2022 | 29 | 29 |
| 2023 | 27 | 24 |
| 2024 | 23 | 26 |
| 2025 | 12 | 18 |
| 2026 | 8 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Package structure and method for fabricating the same1 Sep 2026US 12,727,477 B2Wistron Neweb Corp.
- Semiconductor package23 Jun 2026US 12,666,969 B2Samsung Electronics Co., Ltd.
- Half-buried electrical connection insert rod device28 Apr 2026US 12,616,054 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Package structures with collapse control features14 Apr 2026US 12,604,733 B2Intel Corporation
- Package structures with patterned die backside layer7 Apr 2026US 12,598,989 B2Intel Corporation
- Semiconductor package1 Oct 2026US 2026/0305356 A1Samsung Electronics Co., Ltd.
- Memory system with direct chip attach memory die10 Sep 2026US 2026/0271804 A1Micron Technology, Inc.
- Semiconductor device and manufacturing method thereof27 Aug 2026US 2026/0256019 A1Nanya Technology Corporation
- Three-dimensional integration of processing chiplet and static random-access memory (SRAM) chiplets21 May 2026US 2026/0144154 A1Marvell Asia Pte Ltd
- Packaging device including bumps and method of manufacturing the same7 May 2026US 2026/0130232 A1SK hynix Inc.
Most cited
By later US patents
- Chip-stacked semiconductor package60US 9,543,276 B2Samsung Electronics Co., Ltd. · 2017
- Large sized silicon interposers overcoming the reticle area limitations55US 8,519,543 B1Futurewei Technologies, Inc. · 2013
- Semiconductor device of chip-on-chip structure52US 6,965,166 B2Rohm Co., Ltd. · 2005
- Standoff controlled interconnection51US 5,931,371 AFord Motor Company · 1999
- Reducing stress in multi-die integrated circuit structures48US 8,704,364 B2Xilinx, Inc. · 2014