Large sized silicon interposers overcoming the reticle area limitations

A multi-die integrated circuit assembly, comprising:

• a substrate having a plurality of interconnect conductors;
• an interposer substrate disposed above the substrate, the interposer substrate having a centrally positioned first portion and a second portion adjacent the first portion, the first portion comprising a plurality of through-silicon vias and a plurality of interconnect conductors, and wherein the second portion has an absence of through-hole silicon vias and interconnect conductors;
• a first plurality of connections electrically coupling the interconnect conductors of the substrate with the plurality of through-silicon vias;
• a plurality of integrated circuit dies disposed above the interposer substrate and laterally adjacent from each other, each die in electrical contact with one or more of the plurality of through-silicon vias, wherein the through-silicon vias are adapted to serve as interconnects between the dies and the substrate;
• a second plurality of connections electrically coupling each of the plurality of through-silicon vias with each of the plurality of dies, respectively;
• and
• wherein at least a portion of one of the plurality of dies extends beyond a periphery of the first portion of the interposer substrate.