Standoff controlled interconnection

A method for joining a component to a substrate, comprising:

• applying a base solder portion to at least one of the substrate and the component;
• providing at least one standoff solder portion in the base solder portion for providing a desired solder height, the standoff solder portion having a higher melting temperature than the base solder portion and a height substantially corresponding to a desired standoff height between the component and the substrate;
• mating at least one of the substrate and the component with the standoff solder portion;
• and
• melting the base solder portion under reflow conditions to form a solder joint between the component and the substrate which encapsulates the standoff solder portion.

An interconnection method for a circuit board assembly, comprising:

• depositing a pair of solder paste portions to a surface of a substrate;
• providing a solder ball in each of the pair of solder paste portions, the solder ball having a higher melting temperature than the solder paste portions;
• positioning a component having a pair of mounting surfaces, each mounting surface to mate with a corresponding solder ball so that the diameter of the solder ball substantially corresponds to a desired standoff height between the substrate and the component;
• and
• melting the base solder portion under reflow conditions to form a solder joint between the component and the substrate which encapsulates the solder ball, wherein the reflow conditions create a dendritic structure between the solder paste and the solder ball.