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US 8,704,364 B2Granted
Reducing stress in multi-die integrated circuit structures
AssigneeXilinx, Inc.
InventorBahareh Banijamali
Life of this patent
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Abstract
An integrated circuit structure can include a first interposer and a second interposer. The first interposer and the second interposer can be coplanar. The integrated circuit structure further can include at least a first die that is coupled to the first interposer and the second interposer.
Claims10
An integrated circuit structure comprising:
- a first interposer;
- a second interposer;
- wherein the first interposer and the second interposer are coplanar;
- a first die coupled to the first interposer and the second interposer;
- and
- a second die coupled to the first interposer;
- wherein the first die is communicatively linked to a substrate through the first interposer and through the second interposer;
- wherein the second die is communicatively linked to the substrate only through the first interposer;
- wherein the first interposer and the second interposer each is passive and comprises a plurality of through-silicon vias and at least one patterned metal layer forming wires;
- wherein the first die is coupled to the first and second interposer using solder bumps;
- and
- wherein the second die is coupled to the first interposer using solder bumps.
9 more elements
An integrated circuit structure comprising:
- a substrate comprising a surface;
- a first interposer comprising a first surface and a second surface;
- wherein the first surface of the first interposer is coupled to the surface of the substrate;
- a second interposer comprising a first surface and a second surface;
- wherein the first surface of the second interposer is coupled to the surface of the substrate;
- a third interposer comprising a first surface and a second surface;
- wherein the first surface of the third interposer is coupled to the surface of the substrate;
- a first die coupled to the second surface of the first interposer and the second surface of the second interposer;
- a second die coupled to the second surface of the second interposer and the second surface of the third interposer;
- a fourth interposer comprising a first surface and a second surface;
- and
- a third die coupled to the second surface of the third interposer and the second surface of the fourth interposer;
- and
- wherein the first surface of the fourth interposer is coupled to the surface of the substrate;
- and
- wherein each of the first interposer, the second interposer, the third interposer, and the fourth interposer is in a different quadrant of the surface of the substrate;
- and
- wherein the second die is further coupled to the second surface of the first interposer and the second surface of the fourth interposer.
15 more elements
Dependencies are inferred from the claim text.