H10W 72/801
Interconnections on sidewalls of containers
Official title: {Interconnections on sidewalls of containers}
H10W72/801 (Interconnections on sidewalls of containers) appears on 290 US grants and 277 published applications in this corpus.
Search patents in H10W- Granted patents
- 290
- Published applications
- 277
- Assignees
- 111
- Inventors
- 447
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 6 | 0 |
| 1995 | 4 | 0 |
| 1996 | 9 | 0 |
| 1997 | 5 | 0 |
| 1998 | 5 | 0 |
| 1999 | 5 | 0 |
| 2000 | 7 | 0 |
| 2001 | 12 | 10 |
| 2002 | 12 | 12 |
| 2003 | 4 | 15 |
| 2004 | 16 | 12 |
| 2005 | 8 | 7 |
| 2006 | 6 | 9 |
| 2007 | 9 | 6 |
| 2008 | 1 | 13 |
| 2009 | 9 | 17 |
| 2010 | 14 | 10 |
| 2011 | 12 | 11 |
| 2012 | 11 | 10 |
| 2013 | 16 | 13 |
| 2014 | 12 | 9 |
| 2015 | 10 | 21 |
| 2016 | 19 | 17 |
| 2017 | 16 | 9 |
| 2018 | 6 | 12 |
| 2019 | 11 | 9 |
| 2020 | 7 | 7 |
| 2021 | 3 | 4 |
| 2022 | 5 | 8 |
| 2023 | 5 | 13 |
| 2024 | 7 | 9 |
| 2025 | 4 | 11 |
| 2026 | 7 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Electronic device4 Aug 2026US 12,702,027 B2Advanced Semiconductor Engineering, Inc.
- Substrate for vertically assembled semiconductor dies19 May 2026US 12,635,567 B2Micron Technology, Inc.
- Wafer to wafer high density interconnects5 May 2026US 12,622,318 B2International Business Machines Corporation
- Power module with vertical power paths7 May 2026US 2026/0130296 A1Monolithic Power Systems, Inc.
- Single layer planar multi-turn slice coil30 Apr 2026US 2026/0123380 A1Intel Corporation
- Method for forming an interconnect device and a method for forming a semiconductor package assembly29 Jan 2026US 2026/0033356 A1STATS ChipPAC Pte. Ltd.
- Package structure20 Nov 2025US 2025/0357443 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Die structures and methods of forming the same13 Nov 2025US 2025/0349779 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method for fabricating an integrated circuit module849US 5,353,498 AGeneral Electric Company · 1994
- Embedded substrate for integrated circuit modules421US 5,497,033 AMartin Marietta Corporation · 1996
- Ultra high density integrated circuit packages method357US 5,279,029 AStaktek Corporation · 1994
- Integrated circuit chip stacking322US 4,956,694 ADense-Pac Microsystems, Inc. · 1990
- Single level microelectronic device package with an integral window236US 6,661,084 B1Sandia Corporation · 2003