Connector to electrically couple multiple substrates
AssigneeIntel Corporation
InventorsJiun Hann Sir, Eng Huat Goh, Poh Boon Khoo, Chin Mian Choong, Jooi Wah Wong, Jia Yun Wong
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AssigneeIntel Corporation
InventorsJiun Hann Sir, Eng Huat Goh, Poh Boon Khoo, Chin Mian Choong, Jooi Wah Wong, Jia Yun Wong
Estimating the term…
Embodiments herein relate to systems, apparatuses, or processes for a connector for a modular memory package that includes one or more memory dies on a substrate, where the connector directly electrically couples electrical contacts at an edge and on each side the substrate of the memory package to electrical contacts at an edge and on each side of another substrate that includes a compute die. The connector may include a first plurality of leads that are substantially parallel with each other, and a second plurality of leads that are substantially parallel with each other that are below the first plurality of leads and electrically couple the two substrates. Other embodiments may be described and/or claimed.
A connector comprising:
A system comprising:
A connector comprising:
A connector comprising:
A connector comprising:
Dependencies are inferred from the claim text.