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US 5,279,029 AGranted
Ultra high density integrated circuit packages method
AssigneeStaktek Corporation
InventorCarmen D. Burns
Life of this patent
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Abstract
An ultra-thin level-one integrated circuit package with improved moisture penetration characteristics manufactured using a transfer molded casing with metallic lamination layers is provided. Additionally, a method and apparatus for providing a multiple-element modular package including a plurality of such level-one packages in horizontal or vertical stack configuration is provided.
Claims24
A method of manufacturing a multiple element integrated circuit modular package comprising the steps of:
- (a) providing a plurality of level-one integrated circuit packages of the type including
- an integrated circuit element formed in a silicon substrate, and
- a transfer molded plastic casing surrounding said integrated circuit element, said casing having an upper surface, a lower surface and a perimeter wall;
- and
- wherein said integrated circuit element includes a plurality of electrical interconnect leads extending from said silicon substrate through a portion of said perimeter wall of said casing;
- (b) assembling a module header including a plurality of electrically conductive rails adapted for electrical connection to said leads extending from said level-one packages;
- (c) mounting a first level-one package in said header;
- (d) electrically connecting said leads of said first level-one package to said rails;
- (e) repeating steps (c) and (d) for second and subsequent level-one packages;
- (f) mounting an upper cap member above the last level-one package and securing said cap to said header;
- and
- (g) electrically testing the completed modular package.
9 more elements
A method of manufacturing a multiple-element integrated circuit modular package comprising the steps of:
- (a) providing a plurality of level-one integrated circuit packages of the type including
- an integrated circuit element formed in a silicon substrate, and
- a transfer molded plastic casing surrounding said integrated circuit element, said casing having an upper surface, a lower surface and a perimeter wall;
- and
- wherein said integrated circuit element includes a plurality of electrical interconnect leads extending from said silicon substrate through a portion of said perimeter wall of said casing;
- (b) assembling a module header including a plurality of electrically conductive rails adapted for electrical connection to said leads extending from said level-one packages;
- (c) building a stack of level-one packages comprised of a first level-one package and subsequent level-one packages, beginning by mounting a first level-one package in said header;
- (d) electrically connecting said leads of said first level-one package to said rails;
- (e) placing a preformed adhesive lamination over the upper surface of said first level-one package;
- (f) placing a spacing lamination over said adhesive lamination;
- (g) mounting a subsequent level-one package in said header assembly over said spacing lamination;
- (h) electrically connecting said leads from said subsequent level-one package to said rails;
- (i) testing the assembly for electrical performance;
- (j) removing the spacing lamination if the performance is satisfactory;
- (k) bonding the adhesive lamination between said level-one packages;
- (l) completing the assembly by repeating the steps (e) through (k) until all subsequent level-one packages are mounted, tested and bonded;
- (m) mounting an upper cap member over the last level-one package and securing said cap to said header assembly;
- and
- (n) electrically testing the assembled modular package.
16 more elements
A method of manufacturing a multiple-element integrated circuit package comprising the steps of:
- (a) assembling a plurality of level-one integrated circuit packages each including a plurality of electrical leads for connection to internal integrated circuitry;
- (b) preassembling a module header, including a plurality of conductive rails adapted for electrical and thermal coupling to said leads;
- (c) designating particular leads for each level-one package to be connected to particular rails;
- (d) preparing the designated leads for electrical connection to the designated rails;
- (e) assembling level-one packages into the header and rail assembly, with designated leads positioned for connection to designated rails;
- and
- (f) electrically connecting all the designated leads to the designated rails.
4 more elements
Dependencies are inferred from the claim text.