3D Plus
Buc, FR· latest recorded location
3D PLUS is named on 25 US grants and 26 published applications in this corpus. Its most frequent classification is H10W (Generic packages, interconnections, connectors or other constructional details of devices covered by).
- Granted patents
- 25
- Published applications
- 26
- Inventors
- 12
- Granted in 2026 so far
- 1
- Most recent grant
- 24 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 0 | 1 |
| 2003 | 0 | 1 |
| 2004 | 2 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 2 |
| 2008 | 0 | 3 |
| 2009 | 2 | 2 |
| 2010 | 0 | 1 |
| 2011 | 2 | 2 |
| 2012 | 3 | 1 |
| 2013 | 3 | 2 |
| 2014 | 2 | 1 |
| 2015 | 1 | 0 |
| 2016 | 0 | 2 |
| 2017 | 1 | 1 |
| 2018 | 2 | 1 |
| 2019 | 2 | 2 |
| 2020 | 1 | 1 |
| 2021 | 1 | 2 |
| 2022 | 0 | 0 |
| 2023 | 2 | 1 |
| 2024 | 0 | 0 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. 2026 runs to 8 Oct.
Technology areas
Share of 51 documents
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by41
- H05KPrinted circuits19
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered16
- Y10TTechnical subjects covered by former us classification12
- H01GCapacitors4
- H02MApparatus for conversion between ac and ac, between ac and dc, or4
- Y02BEnergy-efficient buildings4
- B05DProcesses for applying fluent materials to surfaces, in general2
- C23CCoating metallic material2
- G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of2
Recent patents
- Innovative planar electromagnetic component structure24 Mar 2026US 12,586,708 B2
- Resonant power converter28 Feb 2023US 11,594,972 B2
- Process for producing a high-frequency-compatible electronic module21 Feb 2023US 11,587,911 B2
- Apparatus for burning in electronic components20 Jul 2021US 11,067,621 B2
- High frequency DC voltage converter of the quasi-resonant buck type28 Jul 2020US 10,727,748 B2
- Innovative planar electromagnetic component structure27 Apr 2023US 2023/0130364 A1
- Resonant power converter16 Dec 2021US 2021/0391801 A1
- Process for producing a high-frequency-compatible electronic module28 Oct 2021US 2021/0335755 A1
- Apparatus for burning in electronic components2 Jan 2020US 2020/0003826 A1
- High frequency dc voltage converter of the quasi-resonant buck type21 Nov 2019US 2019/0356228 A1
Most cited
By later US patents
- Process for the vertical interconnection of 3D electronic modules by vias28US 8,567,051 B22013
- Process for the collective fabrication of 3D electronic modules26US 7,951,649 B22011
- Three dimensional interconnection method and electronic device obtained by same18US 6,716,672 B22004
- Device for interconnecting, in three dimensions, electronic components14US 6,809,367 B22004
- Process for the collective fabrication of 3D electronic modules12US 7,877,874 B22011