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US 6,809,367 B2Granted
Device for interconnecting, in three dimensions, electronic components
Assignee3D Plus
InventorChristian Val
Life of this patent
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Abstract
The invention relates to a device for interconnecting, in three dimensions, electronic components. In order to decrease the parasitic capacitances between the connections and shielding of the device, metallized grooves are cut in the block of stacked circuits, just clipping the connection to conductors of which are set back from the corresponding face of the block. The assembly is then encapsulated with resin and shielded by metallization. The invention is especially applicable to producing electronic systems in three dimensions with a small size.
Claims6
An electronic device for interconnection in three dimensions comprising:
- packages or circuits containing at least one electronic component and fitted with connection conductors, in which said packages or circuits are stacked and encapsulated with an electrically insulating material to form a block having substantially planar surfaces, opposing faces of the block coming in contact with opposite ends of said conductors,
- wherein the opposite ends of said conductors are set back from said opposing faces of the block,
- wherein said faces comprise grooves having enough depth to just clip respective ends of said conductors and the faces of which are metallized, and
- wherein said block comprises an electrically insulating material encapsulating all of the block and grooves.
1 more element
Dependencies are inferred from the claim text.