Process for producing a high-frequency-compatible electronic module
Assignee3D Plus
InventorChristian VAL
Life of this patent
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Abstract
The field of the invention is that of producing 3D electronic modules, compatible with components operating beyond 1 GHz. The invention relates to a 3D electronic module featuring an interconnection between a horizontal conductor and a vertical conductor to which it is connected exhibits, in a vertical plane, a non-zero curvature. It also relates to the associated production process.
Claims7
A 3D electronic module comprising, in a direction referred to as the vertical direction (Z), a stack of at least two electronic packages, the module being able to be joined to an interconnect circuit, each of the at least two electronic packages comprising:
- a. components provided with interconnect pads that are oriented towards an upper surface of the components, said components being at least partially surrounded by epoxy resin, the interconnect pads of each component being connected by redistribution layers to vertical conductors which are in turn intended to be electrically connected to the interconnect circuit of the module, and
- b. horizontal conductors, a horizontal conductor and the vertical conductor to which it is connected forming an electrical conductor between an interconnect pad of a component and the interconnect circuit,
- the 3D electronic module being wherein the interconnection between a horizontal conductor and the vertical conductor to which it is connected exhibits, in a vertical plane, a non-zero curvature and in that the curvature of the interconnection is covered with epoxy resin.
A process for producing a 3D electronic module able to be joined to an interconnect circuit, further comprising the following steps:
- a. adding (step 100) components provided with interconnect to a first surface of a bonding skin, a lower surface of the components being in contact with the bonding skin and the interconnect pads being oriented towards an upper surface of the components;
- b. depositing (step 101) a first epoxy resin in the space between the components and polymerizing (step 102) the resin in order to obtain a panel;
- c. making (step 103) a groove with a first depth in the space filled with the first epoxy resin, said groove widening towards the upper surface of the panel and laterally exhibiting a curvature;
- d. metallizing (step 104) the grooved panel;
- e. laser-etching (step 105) the metallized grooved panel so as to isolate horizontal conductors;
- f. depositing (step 106) a second epoxy resin in the space formed by the groove;
- g. producing (step 107) one or more photoetched redistribution layers on the upper surface of the panel;
- h. removing the bonding skin in order to obtain a plate;
- i. depositing (step 109) a third epoxy resin on the upper surface of the plate;
- j. stacking (step 110) a second plate on the plate covered with the third epoxy resin;
- k. making (step 111) a through-groove in the space filled with the second epoxy resin;
- l. metallizing (step 112) the through-groove in order to obtain a vertical conductor.
Dependencies are inferred from the claim text.