Apparatus for burning in electronic components
Assignee3D Plus
InventorMohamed Boussadia
Life of this patent
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Abstract
An apparatus for burning in electronic components, which includes a plurality of assemblies placed in a holder, each assembly comprising a printed circuit board on which are placed sockets intended to receive electronic components and a burn-in driver. The holder is at room temperature, and each assembly comprises a single chamber that is regulated to a temperature T°>80° C., in which chamber at least four sockets are placed. The printed circuit board forming one wall of the chamber, the burn-in driver is soldered directly to the printed circuit board on the side exterior to the chamber, with a single burn-in driver per chamber, and the assembly furthermore comprises means for dissipating only the thermal energy of operation of the burn-in driver.
Claims3
A burn-in apparatus for burning in electronic components, which comprises a plurality of assemblies placed in a holder, each assembly comprising a printed circuit board on which are placed sockets intended to receive electronic components comprising at least one DDR3 SDRAM memory or more, and a burn-in driver, the holder being at room temperature, each assembly comprising a single chamber that is regulated to a temperature T°>80° C., in which chamber at least four sockets are placed, the printed circuit board forming one wall of the chamber, the sockets being directly placed on the printed circuit board on the side interior to the chamber, the burn-in driver being soldered directly to the printed circuit board on the side exterior to the chamber, with a single burn-in driver per chamber, and the assembly furthermore comprising means for dissipating only the thermal energy of operation of the burn-in driver, wherein the distance on the printed circuit board between the burn-in driver and the sockets closest to the burn-in driver is smaller than 8 cm.
Dependencies are inferred from the claim text.