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US 4,956,694 AGranted
Integrated circuit chip stacking
AssigneeDense-Pac Microsystems, Inc.
InventorFloyd Eide
Life of this patent
Estimating the term…
Abstract
A device for increasing the density of integrated circuit chips on a printed circuit board. A plurality of integrated circuits are packaged within chip carriers and stacked, on one top of the other, on a printed circuit board. Each of the input/output data terminals, power and ground terminals of the chips are connected in parallel. Each chip is individually accessed by selectively enabling the desired chip.
Claims25
An electronic circuit comprising:
- a first electronic component having a first data input/output terminal and a first enable terminal;
- a second electronic component having a second data input/output terminal and a second enable terminal;
- stacking means for stacking the first electronic component on the second electronic component;
- first connecting means for electrically connecting the first data input/output terminal to the second data input/output terminal;
- first conducting means connected to the first enable terminal for providing electrical conduction to the first enable terminal;
- and
- second conducting means connected to the second enable terminal for providing electrical conduction to the second enable terminal independent of the first enable terminal.
4 more elements
An electronic component package, comprising:
- (a) a body defining a cavity therein;
- (b) a plurality of spaced electrical contacts within the cavity;
- (c) a plurality of spaced electrical conductors at the exterior of the body;
- (d) means for electrically connecting the electrical contacts to respective electrical conductors;
- and
- (e) a plurality of connecting pads within the cavity adjacent to and spaced from the electrical contacts, the connecting pads being electrically interconnected to each other.
3 more elements
An electronic assembly, comprising:
- (a) a first body defining a cavity therein, the body including first and second opposing surfaces;
- (b) a plurality of spaced first electrical contacts within the cavity;
- (c) plural spaced pairs of second electrical contacts, one contact of each pair being disposed on the first surface, the other contact of each pair being disposed on the second surface;
- and
- (d) means for electrically connecting the first contacts to respective pairs of the second contacts.
2 more elements
An electronic assembly, comprising:
- (a) a first body defining a cavity therein, the body including first and second opposing surfaces and first sides extending from the first to the second surface;
- (b) a plurality of spaced first electrical contacts within the cavity;
- (c) a plurality of first electrical conductors, at least one conductor extending from the first to the second surface of the first body;
- (d) plural spaced pairs of second electrical contacts, one contact of each pair being disposed on the first surface, the other contact of each pair being disposed on the second surface, a pair of the second electrical contacts being electrically connected by one of the plurality of first electrical conductors;
- and
- (e) means for electrically connecting the first contacts to respective pairs of the second contacts.
3 more elements
Dependencies are inferred from the claim text.