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AssigneeMicron Technology, Inc.
InventorsKunal R. Parekh, Bret K. Street, Kyle K. Kirby, Wei Zhou, Thiagarajan Raman
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This document discloses techniques, apparatuses, and systems for providing a semiconductor device assembly with a substrate for vertically assembled semiconductor dies. A semiconductor assembly is described that includes a semiconductor die coupled to a substrate such that an active surface of the semiconductor die is substantially orthogonal to a top surface of the substrate. The substrate includes a surface having a recessed slot at which a side surface of the semiconductor die couples. The semiconductor die includes a contact pad that couples to a contact pad at the recessed slot. In doing so, the techniques, apparatuses, and systems herein enable a robust and cost-efficient semiconductor device to be assembled.
A semiconductor device assembly, comprising:
A method of assembling a semiconductor device, comprising:
A semiconductor device assembly comprising:
Dependencies are inferred from the claim text.