Method for forming an interconnect device and a method for forming a semiconductor package assembly
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsGunHyuck LEE, SangHyun SON
Life of this patent
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Abstract
A method for forming an interconnect device. The method comprises: forming an insulating frame, wherein the insulating frame comprises: a top insulating layer formed uppermost of the insulating frame; a bottom insulating layer formed lowermost of the insulating frame; and a central insulating layer that includes a plurality of insulators disposed between the top insulating layer and the bottom insulating layer; and forming a plurality of bridge conductors extending between a first lateral surface and a second lateral surface of the central insulating layer.
Claims20
A method for forming an interconnect device, the method comprising:
- forming an insulating frame, wherein the insulating frame comprises:
- a top insulating layer formed uppermost of the insulating frame;
- a bottom insulating layer formed lowermost of the insulating frame;
- and
- a central insulating layer that includes a plurality of insulators disposed between the top insulating layer and the bottom insulating layer;
- and
- forming a plurality of bridge conductors extending between a first lateral surface and a second lateral surface of the central insulating layer.
A method for forming an interconnect device, the method comprising:
- forming a plurality of insulators having a first lateral surface and a second lateral surface opposite to the first lateral surface;
- and
- forming a plurality of bridge conductors, wherein every two of the plurality of bridge conductors are separated from each other by one of the plurality of insulators, and the plurality of bridge conductors extend between the first lateral surface and the second lateral surface of the plurality of insulators.
A method for forming a semiconductor package assembly, the method comprising:
- providing an assembly substrate;
- attaching an interconnect device onto the assembly substrate, wherein the interconnect device comprises a first lateral surface, a second lateral surface opposite to the first lateral side, and a plurality of bridge conductors extending therebetween;
- attaching a first semiconductor package having one or more lateral connectors exposed from its lateral surface such that the one or more lateral connectors of the first semiconductor package are adjacent to the first lateral surface of the interconnect device;
- attaching a second semiconductor package having one or more lateral connectors exposed from its lateral surface such that the one or more lateral connectors of the second semiconductor package are adjacent to the second lateral surface of the interconnect device;
- and
- connecting at least one of the one or more lateral connectors of the first semiconductor package with at least one of the one or more lateral connectors of the second semiconductor package via at least one of the plurality of bridge conductors.
A method for forming a semiconductor package assembly, the method comprising:
- attaching onto a tape a first semiconductor package having one or more lateral connectors exposed from its lateral surface;
- attaching onto the tape a second semiconductor package having one or more lateral connectors exposed from its lateral surface such that a gap is formed between the first and second semiconductor packages;
- inserting within the gap an interconnect device having a plurality of bridge conductors extending between its lateral surfaces, such that the plurality of bridge conductors are between the one or more lateral connectors of the first semiconductor package and the one or more lateral connectors of the second semiconductor package;
- connecting at least one of the one or more lateral connectors of the first semiconductor package with at least one of the one or more lateral connectors of the second semiconductor package via at least one of the plurality of bridge conductors;
- detaching the first and second semiconductor packages and the interconnect device from the tape;
- and
- attaching the first and second semiconductor packages and the interconnect device onto an assembly substrate.
Dependencies are inferred from the claim text.