H10W 72/701
Tape-automated bond [tab] connectors
Official title: {Tape-automated bond [TAB] connectors}
H10W72/701 (Tape-automated bond [tab] connectors) appears on 1,000 US grants and 566 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,000
- Published applications
- 566
- Assignees
- 298
- Inventors
- 1,548
- Latest grant
- 27 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 7 | 0 |
| 1978 | 4 | 0 |
| 1979 | 1 | 0 |
| 1980 | 4 | 0 |
| 1981 | 3 | 0 |
| 1982 | 5 | 0 |
| 1983 | 8 | 0 |
| 1984 | 8 | 0 |
| 1985 | 6 | 0 |
| 1986 | 6 | 0 |
| 1987 | 8 | 0 |
| 1988 | 14 | 0 |
| 1989 | 24 | 0 |
| 1990 | 23 | 0 |
| 1991 | 31 | 0 |
| 1992 | 29 | 0 |
| 1993 | 29 | 0 |
| 1994 | 29 | 0 |
| 1995 | 20 | 0 |
| 1996 | 22 | 0 |
| 1997 | 25 | 0 |
| 1998 | 49 | 0 |
| 1999 | 36 | 0 |
| 2000 | 46 | 0 |
| 2001 | 60 | 40 |
| 2002 | 58 | 61 |
| 2003 | 49 | 30 |
| 2004 | 23 | 33 |
| 2005 | 29 | 32 |
| 2006 | 21 | 37 |
| 2007 | 26 | 21 |
| 2008 | 28 | 32 |
| 2009 | 20 | 26 |
| 2010 | 17 | 22 |
| 2011 | 18 | 17 |
| 2012 | 14 | 20 |
| 2013 | 23 | 17 |
| 2014 | 15 | 17 |
| 2015 | 20 | 18 |
| 2016 | 12 | 20 |
| 2017 | 15 | 15 |
| 2018 | 18 | 23 |
| 2019 | 24 | 19 |
| 2020 | 14 | 16 |
| 2021 | 16 | 11 |
| 2022 | 9 | 13 |
| 2023 | 9 | 13 |
| 2024 | 10 | 4 |
| 2025 | 7 | 5 |
| 2026 | 3 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electronic component, electric device including the same, and bonding method thereof27 Jan 2026US 12,538,424 B2Samsung Display Co., Ltd.
- Interconnect structure20 Jan 2026US 12,532,731 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Bonding and indexing method20 Jan 2026US 12,532,763 B2Nexperia B. V.
- Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulation molded body, and method for manufacturing semiconductor package7 Oct 2025US 12,435,248 B2
- Flex bonded integrated circuits7 Oct 2025US 12,438,114 B2Meta Platforms, Inc.
- Electronic component, electric device including the same, and bonding method thereof14 May 2026US 2026/0136465 A1Samsung Display Co., Ltd.
- Pre-patterned adhesive tape for enabling double-sided circuit assembly30 Apr 2026US 2026/0123461 A1NXP USA, Inc.
- Tape and manufacturing method thereof5 Mar 2026US 2026/0068058 A1Chipbond Technology Corporation
- Method for producing an smd power semiconductor component module and smd power semiconductor component module22 Jan 2026US 2026/0026388 A1
- Semiconductor package11 Dec 2025US 2025/0379180 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Semiconductor chip assemblies with fan-in leads734US 5,148,265 AIST Associates, Inc. · 1992
- Tab grid array357US 5,397,921 AAdvanced Semiconductor Assembly Technology · 1995
- Method for producing high speed integrated circuits354US 5,214,845 AMicron Technology, Inc. · 1993
- Packaged semiconductor device having tab tape and particular power distribution lead structure332US 5,252,853 AMitsubishi Denki Kabushiki Kaisha · 1993
- Lead connections means for stacked tab packaged IC chips312US 5,138,438 AAkita Electronics Co., Ltd. · 1992