Method for producing an smd power semiconductor component module and smd power semiconductor component module

A method for producing a surface mounted device (SMD) power semiconductor component module, comprising the following steps:

• providing an SMD circuit carrier equipped with contact points and an insulation;
• providing at least one discrete power semiconductor component equipped with electrically conductive connection elements, comprising connection legs;
• arranging the at least one discrete power semiconductor component, equipped with electrically conductive connection elements, on the side of the SMD circuit carrier equipped with the contact points, wherein the connection elements of the power semiconductor component contact the contact points of the SMD circuit carrier;
• and
• connecting the connection elements to the respectively assigned contact points by laser welding, wherein between the at least one power semiconductor component and the SMD circuit carrier, a pressure contact for electrical and thermal contacting is additionally created,
• wherein the pressure contact is created via a holding part by clamping the arrangement of power semiconductor component and SMD circuit carrier between the holding part and a counter bearing which is located on the installation side.