Pre-patterned adhesive tape for enabling double-sided circuit assembly
AssigneeNXP USA, Inc.
InventorsNamrata Kanth, Scott M. Hayes, Stephen Ryan Hooper, Douglas Michael Shade
Life of this patent
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Abstract
A method of producing a circuit die where the method includes applying a pre-patterned backing tape to a first surface of a semiconductor substrate that includes the first surface and a second surface, the second surface including one or more circuits; coating the second surface with an encapsulant; removing a patterned portion of the pre-patterned backing tape to expose one or more contact pads on the first surface; applying one of an electrically conductive adhesive (ECA) or solder to the one or more contact pads on the first surface; and coupling an electrical component to the contact pads using the ECA or solder.
Claims20
A method of producing a circuit die, the method comprising:
- applying a pre-patterned backing tape to a first surface of a semiconductor substrate that includes the first surface and a second surface, the second surface including one or more circuits;
- coating the second surface with an encapsulant;
- removing a patterned portion of the pre-patterned backing tape to expose one or more contact pads on the first surface;
- applying one of an electrically conductive adhesive (ECA) or solder to the one or more contact pads on the first surface;
- and
- coupling an electrical component to the contact pads using the ECA or solder.
A device comprising:
- a circuit package including a semiconductor substrate including an active surface and a second surface, the semiconductor substrate including a circuit coupled to one or more contact pads of an active surface of the semiconductor substrate and including an encapsulant material disposed on the active surface and at least partially over the circuit;
- a patterned backing tape coupled to the second surface of the semiconductor substrate, the patterned backing tape including a remaining portion including openings corresponding to a pattern of a removed patterned portion, the openings at least partially aligned with one or more contact pads on the second surface of the semiconductor substrate;
- and
- a circuit component coupled to the one or more contact pads on the second surface of the semiconductor substrate.
Dependencies are inferred from the claim text.