Interconnect structure

An interconnect structure comprising:

• a plurality of first pads arranged to form a first array, wherein the first array has a first row, a second row and an mth row extending along a first direction and parallel to each other along a second direction, wherein the first pads in each of the first row, the second row and the mth row are grouped into a first group, a second group and an nth group extending along the second direction, m is an integer equal to or greater than 2, and n is an integer equal to or greater than 2;
• a plurality of second pads arranged to form a second array, wherein the second array has a first row, a second row and an mth row extending along the first direction and parallel with each other along the second direction, wherein the second pads in each of the first row, the second row and the mth row are grouped into a first group, a second group and an nth group extending along the second direction;
• and
• a plurality of first conductive lines disposed in a first layer, a plurality of second conductive lines disposed in a second layer and a plurality of nth conductive lines disposed in an nth layer, wherein the first layer, the second layer and the nth layer are stacked to form a multi-layered structure,
• wherein the first pads and the second pads are disposed over the first layer, the second layer and the nth layer,
• wherein a quantity of the layers of the multi-layered structure is equal to a quantity of the groups of the first pads, and equal to a quantity of the groups of the second pads,
• wherein each of the first pads in the first row in the first group of the first array is electrically connected to one of the second pads in the first row in the first group of the second array by one of the first conductive lines in the first layer, and electrically isolated from the second pads in the second group and the nth group,
• wherein each of the first pads in the first row in the second group of the first array is electrically connected to one of the second pads in the first row in the second group of the second array by one of the second conductive lines in the second layer, and electrically isolated from the second pads in the first group and the nth group, and
• wherein each of the first pads in the first row in the nth group of the first array is electrically connected to one of the second pads in the first row in the nth group of the second array by one of the nth conductive lines in the nth layer, and electrically isolated from the second pads in the first group and the second group.

An interconnect structure comprising:

• a plurality of first pads arranged to form a first column-and-row array;
• a plurality of second pads arranged to form a second column-and-row array;
• and
• a plurality of conductive lines,
• wherein the first column-and-row array, the second column-and-row array and the plurality of conductive lines are disposed in a same layer,
• wherein the first pads in a first row and a second row of the first column-and-row array are separated from each other by a first vertical distance from a plan view, the second pads in a first row and a second row of the second column-and-row array are separated from each other by a second vertical distance from the plan view,
• wherein the first pad in the first row and a first column of the first column-and-row array is electrically connected to the second pad in the first row and a first column of the second column-and-row array by a first conductive line of the plurality of conductive lines,
• wherein the first pad in the first row and a second column of the first column-and-row array is electrically connected to the second pad in the first row and a second column of the second column-and-row array by a second conductive line of the plurality of conductive lines,
• wherein a sum of widths of the first and second conductive lines is less than the first vertical distance and the second vertical distance from the plan view.