H10W 72/834
Interconnections on sidewalls of chips
Official title: {Interconnections on sidewalls of chips}
H10W72/834 (Interconnections on sidewalls of chips) appears on 793 US grants and 721 published applications in this corpus.
Search patents in H10W- Granted patents
- 793
- Published applications
- 721
- Assignees
- 227
- Inventors
- 1,229
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 4 | 0 |
| 1989 | 4 | 0 |
| 1990 | 4 | 0 |
| 1991 | 12 | 0 |
| 1992 | 6 | 0 |
| 1993 | 4 | 0 |
| 1994 | 8 | 0 |
| 1995 | 12 | 0 |
| 1996 | 23 | 0 |
| 1997 | 33 | 0 |
| 1998 | 28 | 0 |
| 1999 | 25 | 0 |
| 2000 | 16 | 0 |
| 2001 | 20 | 17 |
| 2002 | 37 | 42 |
| 2003 | 21 | 28 |
| 2004 | 33 | 33 |
| 2005 | 20 | 28 |
| 2006 | 26 | 39 |
| 2007 | 28 | 42 |
| 2008 | 19 | 32 |
| 2009 | 21 | 47 |
| 2010 | 27 | 48 |
| 2011 | 51 | 55 |
| 2012 | 35 | 55 |
| 2013 | 64 | 39 |
| 2014 | 42 | 32 |
| 2015 | 27 | 19 |
| 2016 | 36 | 25 |
| 2017 | 22 | 19 |
| 2018 | 14 | 12 |
| 2019 | 10 | 11 |
| 2020 | 11 | 10 |
| 2021 | 11 | 11 |
| 2022 | 10 | 10 |
| 2023 | 2 | 8 |
| 2024 | 6 | 17 |
| 2025 | 5 | 19 |
| 2026 | 7 | 23 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package and semiconductor package assembly with edge side interconnection29 Sep 2026US 12,751,308 B2Etron Technology, Inc.
- 3D IC structure18 Aug 2026US 12,713,625 B2Etron Technology, Inc.
- Dummy pattern structure for reducing dishing19 May 2026US 12,635,502 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure and semiconductor device28 Apr 2026US 12,615,782 B2Changxin Memory Technologies, Inc.
- Semiconductor structure and method for fabricating same31 Mar 2026US 12,593,671 B2Changxin Memory Technologies, Inc.
- Backside power delivery20 Aug 2026US 2026/0247966 A1
- Backside power delivery20 Aug 2026US 2026/0247967 A1
- Semiconductor Package with Side Wall Interconnection23 Jul 2026US 2026/0215339 A1Avago Technologies International Sales Pte. Limited
- Semiconductor package2 Jul 2026US 2026/0191009 A1Samsung Electronics Co., Ltd.
- Semiconductor package and method of manufacturing semiconductor package2 Jul 2026US 2026/0191100 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Method for fabricating an integrated circuit module849US 5,353,498 AGeneral Electric Company · 1994
- Three-dimensional multichip package444US 5,481,133 AUnited Microelectronics Corp. · 1996
- Semiconductor integrated circuit device and method of manufacturing the same437US 4,982,265 AAkita Electronics Co., Ltd. · 1991
- Embedded substrate for integrated circuit modules421US 5,497,033 AMartin Marietta Corporation · 1996
- Stack of IC chips in lieu of single IC chip394US 5,581,498 AIrvine Sensors Corporation · 1996